Product category:
Design and Development Software
News Release from: Ansoft Europe | Subject: TPA v5
Edited by the Electronicstalk Editorial
Team on 19 January 2007
Analyser addresses larger-sized
packaging problems
Software introduces new automation, design flow and simulation capability needed for the extraction of the electrical characteristics of complex high-performance BGA style packaging.
The latest version of Ansoft Turbo Package Analyzer (TPA) introduces new automation, design flow and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging, including wirebond (WBBGA), flip-chip (FCBGA), chip-scale packages (CSPs) and system in packages (SiPs) TPA v5 increases the capacity of the solver to address larger-sized packaging problems and introduces greater automation for generating and/or modifying 3D package layouts
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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TPA v5 introduces a new user interface that includes new 2D editing and 3D viewing capabilities, unlimited undo/redo capability, powerful new editing and automation features, such as geometry validation checking and support for VB scripting.
Combined with AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v5 generates resistance, inductance and capacitance (RLC) models directly from popular package design tools.
It accepts CAD data and fully characterises the entire package in three dimensions.
Extracted subcircuits can be exported into Nexxim, the company's high-performance circuit simulation software, or existing Spice tools (Spice/Ibis format) for subsequent transient analyses, such as crosstalk, overshoot and TDR.
TPA v5 is available for Microsoft Windows XP Professional, Windows XP x64 Edition and Windows Server 2003.
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