Product category:
Design and Development Software
News Release from: Ansoft Europe | Subject: HFSS, SIwave and DesignerSI
Edited by the Electronicstalk Editorial
Team on 02 July 2007
Simulation suite bypasses networking
prototypes
ZTE engineers predict radiated emissions and induced interference from PCBs and examine multiple PCBs within a cabinet to determine trends for system-level emission.
Ansoft Corp has formed a strategic partnership with ZTE Corporation, China's largest listed telecommunications equipment provider of customised network solutions for telecomms carriers worldwide Using Ansoft signal and power integrity analysis software, ZTE engineers are now able to predict radiated emissions and induced interference from printed circuit boards (PCBs) and to examine multiple PCBs within a cabinet to determine trends for system-level emission
This article was originally published on Electronicstalk on 10 Mar 2008 at 8.00am (UK)
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The new design methodology has allowed ZTE to eliminate expensive build-test-repeat iterations in its design cycle.
"Our engineers are very experienced in PCB design and needed to expand capabilities for EMI/EMC.
Previously, we were using expensive and time-consuming prototyping and testing to make sure the design performance met requirements", says Zhu Shunlin, Chief Engineer of the EDA group at ZTE.
"Ansoft's design methodology and technical support team helped us solve this issue, improve product performance, reduce cost and speed our time to market".
"We have taken our R and D team's capabilities to the next level".
The design flow comprises: Ansoft's HFSS, the industry-leading full-wave electromagnetic field simulation software; SIwave, a full-wave electromagnetic field simulator optimised for PCB signal and power integrity analysis; and DesignerSI, an integrated schematic and design management front-end for signal integrity analysis and system verification.
ZTE engineers perform board-level simulations in SIwave to produce accurate full-wave modelling and to develop design rules so they can design with EMC compliance in mind.
They combine results from individual board simulations in more comprehensive HFSS simulations of full 3D systems including multiple boards placed in a backplane and chassis.
This design flow has allowed ZTE to improve signal integrity, reduce emissions and eliminate unnecessary shielding.
"With the increased clock speed and operating frequencies of today's PCBs, it is essential that companies adopt an electromagnetic-based design flow to understand the performance of high-speed electronic products", says Thomas Flynn, Vice President of sales at Ansoft.
"It is an honour to partner with ZTE and help them achieve first-pass system success in designing their high-performance telecommunications equipment".
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