Product category:
Power Supply ICs and Controllers
News Release from: Advanced Analogic Technologies
Edited by the Electronicstalk Editorial
Team on 03 May 2006
Taiwanese foundry takes on power process
Vanguard International Semiconductor is to integrate AnalogicTech's 0.35um ModularBCD process technology into its advanced 200mm submicron fabrication facilities in Taiwan.
Advanced Analogic Technologies and Vanguard International Semiconductor Corporation (VIS), a leading specialty IC foundry service provider, have announced plans to integrate AnalogicTech's 0.35um multiple-voltage mixed-signal ModularBCD process technology into VIS' advanced 200mm submicron fabrication facilities in Taiwan The deployment of AnalogicTech's ModularBCD process technology is part of the VIS strategy to extend its process spectrum of BCD (bipolar-CMOS-DMOS) technology, and enhances the position of VIS as a leader in the specialty foundry industry
This article was originally published on Electronicstalk on 16 Jun 2004 at 8.00am (UK)
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For AnalogicTech, manufacturing ModularBCD wafers in world-class VIS facilities furthers its corporate strategy to re-use DRAM fabs for the production of new-generation power management ICs products benefiting from process technology especially developed by AnalogicTech for such advanced equipment sets.
According to the agreement, VIS will manufacture wafers for AnalogicTech and also offer the process for foundry to other fabless companies and IDMs for products that do not compete directly with AnalogicTech's power management offerings.
"AnalogicTech's customers are developing handsets and consumer electronics that demand the highest quality standards - even more strict than many high-density DRAM devices", said Allen Lam, Vice President of Worldwide Operations for AnalogicTech.
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"As a leading specialty IC foundry service provider, VIS has a proven track record of high quality, high volume foundry services that will enable us to meet or exceed customer expectations with our new ModularBCD products".
"VIS is committed to becoming the world leader in specialty and customised IC manufacturing foundry services", said Steve Pletcher, Managing Director at VIS Micro (VIS' marketing arm in North America).
"Collaborating with the power and analogue technology experts at AnalogicTech strengthens VIS' portfolio of specialty processes and helps us meet diverse customer demands".
"Complementing our extensive analogue CMOS, high-voltage, mixed-signal, and conventional BCD foundry offering, the high-integration, electrical isolation and multi-voltage capability of ModularBCD is ideal for today's complex ICs and system-on-chip integration".
"Such capability translates into high performance and reduced technical risk for our customers".
Unlike conventional BCD technologies that rely on high temperature processes and expensive epitaxial deposition to achieve electrical isolation, ModularBCD employs a modern, low-temperature CMOS-like manufacturing flow capable of high yields without sacrificing device performance or electrical isolation.
Furthermore, the principle of "modularity" means process modules and devices for different voltages can be added or removed in a modular fashion without redesigning circuitry, making analogue and mixed signal circuit reuse a viable design methodology.
"We are excited to see ModularBCD deployed in VIS' advanced manufacturing facilities", commented Richard K Williams, President, CEO, and CTO for AnalogicTech.
"As part of a carefully managed and highly-selective long-term multi-source supply and license strategy, our agreement with VIS offers further support that by manufacturing in high-volume ex-DRAM facilities, ModularBCD wafer capacity should be able to keep pace with global demand, both for AnalogicTech and VIS' other foundry customers".
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