Product category:
Design and Development Software
News Release from: Apache Design Solutions
Edited by the Electronicstalk Editorial
Team on 30 October 2007
Optimal acquisition for Apache
Optimal's production proven package and PCB extraction and analysis solution for power, signal, and thermal integrity compliments Apache's newly introduced Sentinel product line.
Apache Design Solutions has signed a definitive agreement to acquire Optimal Corporation, a leader in 3D power, signal and thermal analysis for package, system-in-package (SiP) and board designs Under the terms of the agreement, Apache will commence a cash tender offer to purchase Optimal for an undisclosed amount
This article was originally published on Electronicstalk on 14 Jun 2005 at 8.00am (UK)
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Through this acquisition Apache further strengthens its leadership position in power and noise analysis from the chip domain to the package and system domains.
Optimal's production proven package and PCB extraction and analysis solution for power, signal, and thermal integrity compliments Apache's newly introduced Sentinel product line targeted at system power and I/O signal integrity.
Power is a system-wide challenge, and companies can no longer keep IC, package and PCB designers in an isolated environment with suboptimal performance, increasing production cost and risk of failures.
A system-level power and noise solution with a tightly integrated environment that addresses the multidomain challenges will be a key requirement for the electronics design community.
"We see a lot of synergy between Apache and Optimal's product lines".
"Optimal is a leader in package-domain power and signal integrity with over 60 active customers worldwide".
"Additionally, its products have been validated and included in the TSMC Reference Flow for the past four years".
"This acquisition is part of Apache's strategic plan to provide the best-in-class power and noise flow from the IC to the package domain", says Andrew Yang, CEO of Apache.
"We are excited to become part of Apache and deliver solutions that enable designers to analyse and resolve power issues from early in the design process through silicon and package signoff".
"By joining forces, we can deliver much needed innovation to the semiconductor industry by creating a unique platform that addresses the power and signal integrity needs across chip, package and system", says Dave DeMaria, CEO of Optimal Corporation.
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