Product category:
PCB Connectors
News Release from: Ardent Concepts | Subject: Redundant Contact contactors and interfaces
Edited by the Electronicstalk Editorial
Team on 11 August 2003
Novel contact enables high-speed
interfaces
Ardent Concepts has developed a new line of contactors and interconnect interfaces based on its novel Redundant Contact interconnect technology.
Ardent Concepts has developed a new line of contactors and interconnect interfaces based on its novel Redundant Contact interconnect technology Ardent Concepts President and founder Gordon Vinther is pleased to offer the high performance interconnect industry the Redundant Contact
This article was originally published on Electronicstalk on 22 Oct 2003 at 8.00am (UK)
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Test interface lines up eight IC packages
Ardent Concepts has developed a strip test interface technology for IC packages.
Novel contact simplifies PGA test fixtures
A new range of high-performance PGA test fixture solutions is based on innovative proprietary interconnect technology - the Redundant Contact.
"This new contact is a compliant wire-form interconnect technology.
It offers super short test heights, low self-inductance, high bandwidth and cycle life without the shortcomings of spring pins or conductive rubber.
The Redundant Contact has unparalleled performance in the way of low signal loss, and is capable of replacing high-node-count conductive elastomer applications with a more consistent, lower force interconnection".
The new all-metal contact technology offers electrical invisibility with a measured self inductance of 0.5nH and a -1dB loop through bandwidth of 24GHz and a -3dB bandwidth over 30GHz in 0.5mm pitch configuration.
The Redundant Contact achieves low contact resistance by using a low surface area contact patch.
This allows engineers to design high-node-count interconnections without high levels of contact force.
The Redundant Contact is able to accommodate a wide variety of applications in area array and peripherally leaded interconnect designs.
The Redundant Contact can achieve pitches of 0.25mm, and is capable of Kelvin contacting on 0.5mm-pitch devices.
The contact technology is ideal for RF testing of various package types including QFN packages, PCB to PCB as well as all other chip scale, flip chip, substrate and other packaged IC interconnections.
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