Product category:
Test Accessories
News Release from: Ardent Concepts | Subject: Redundant Contact LGA contactors
Edited by the Electronicstalk Editorial
Team on 04 May 2004
Contact technology switches to processor
testing
Ardent Concepts has begun shipping high-performance LGA contactor solutions based on its novel Redundant Contact technology.
Ardent Concepts has begun shipping high-performance LGA contactor solutions based on its novel Redundant Contact technology "With a solid footing in the RF device test market, the next logical application for our solution was LGA-style processors", says Steve Cleveland, Ardent Concepts Vice President for Business Development
This article was originally published on Electronicstalk on 11 Aug 2003 at 8.00am (UK)
Related stories
Novel contact enables high-speed interfaces
Ardent Concepts has developed a new line of contactors and interconnect interfaces based on its novel Redundant Contact interconnect technology.
Test interface lines up eight IC packages
Ardent Concepts has developed a strip test interface technology for IC packages.
"Our customer needed a reliable testing solution for ceramic packages with over 1000 I/Os.
The short test height, high speed capability and consistent resistance of the Redundant Contact architecture provide them with a durable, flexible contactor solution".
The all-metal Redundant Contact technology offers electrical invisibility with a measured self-inductance of 0.5nH and a -1dB insertion loss at 24GHz and a -3dB bandwidth over 30GHz in 0.5mm pitch configuration.
The Redundant Contact achieves low contact resistance by using a low surface area contact patch.
This allows engineers to design high-node-count interconnections without high levels of contact force.
The Redundant Contact can accommodate a wide variety of applications in area array and peripherally leaded interconnect designs.
The Redundant Contact can achieve pitches of 0.25mm, and is capable of Kelvin contacting on 0.5mm pitch devices.
The contact technology is ideal for RF testing of various package types including QFN packages, PCB to PCB as well as all other chip scale, flip chip, substrate and other packaged IC interconnections.
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