Product category:
Memory Devices and Modules
News Release from: Microchip Technology | Subject: 24LC512, 24AA512 and 24FC512
Edited by the Electronicstalk Editorial
Team on 18 March 2003
Bigger serial EEPROM keeps its head down
onboard
Microchip's new 512Kbit I2C-compatible serial EEPROMs are the first to be available in an 8-pad dual flat no-lead package.
Microchip's new 512Kbit I2C-compatible serial EEPROMs are the first to be available in an 8-pad dual flat no-lead package The 6 x 5 x 0.9mm DFN packages are ideal for low-headroom applications, reducing cost and increasing available board space
This article was originally published on Electronicstalk on 10 Apr 2001 at 8.00am (UK)
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World's first serial EEPROM supporting ACR SIG
Microchip has announced the world's first serial EEPROM supporting the Advanced Communications Riser Special Interest Group (ACR SIG) specification.
The 24LC512, 24AA512 and 24FC512 use Microchip's advanced PMOS electrically erasable cell (PEEC) process technology to produce high-density, low-power EEPROMs in one of the thinnest packages available.
PEEC process technology also ensures reliability, achieving more than 200 years data retention and 1 million erase/write cycles at 85C.
Users of Microchip's 128 or 256Kbit EEPROMs can use these higher-density EEPROMs while retaining the same footprint.
Additional packages include an 8-lead PDIP, 8-lead SOIC and 14-pin TSSOP.
The devices have a page-write capability of up to 128byte, and can perform random reads throughout the entire array.
Functional address lines allow up to eight devices on the same bus for a maximum of 4Mbit total address space.
Additional features include a fast write time of 5ms, a clock rate of 400kHz throughout the operating voltage of 2.5-5.5V and temperature range of -40 to +85C.
The 24FC512 can operate at a bus speed of 1MHz and the 24AA512 has an operating voltage of 1.8-5.5V.
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