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News Release from: ASML | Subject: Twinscan XT:1900i
Edited by the Electronicstalk Editorial
Team on 13 July 2006
ASML expands immersion product suite
ASML expands immersion product suite with introduction of advanced 40nm immersion system
ASML Holding(ASML) has introduced the semiconductor industry's most advanced lithography system, the ASML Twinscan XT:1900i In combination with ASML proprietary low k1 capabilities, this new system extends optical lithography for volume production to 40 nm and below
This article was originally published on Electronicstalk on 17 Jul 2007 at 8.00am (UK)
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With the introduction of this latest immersion system, ASML now offers immersion solutions for its customers for resolutions from 65 to 40 nm with three different products that allow for seamless system transition by customers: from one resolution to the next.
The XT:1400i is already being used in production and the first qualification lots have now been produced on the XT:1700i with production ramp-up at customer sites expected to follow as early as Q4 2006.
"This fifth generation immersion system builds upon the success of its predecessors to satisfy customer's needs for continuous shrink".
"The XT:1900i is an immersion system for the most critical layers," said Martin van den Brink, executive vice president, marketing and technology, ASML.
"We introduced our first immersion RandD system in Q4 2004 and, so far, ASML has shipped 20 ASML immersion systems to three continents".
"We continue our immersion leadership and we now offer our customers a full suite of immersion products." The new XT:1900i is based on previous generations of immersion technology proven on systems installed at customer sites worldwide.
The XT:1900i leverages the Twinscan platform's dual wafer stage functionality for parallel dry metrology and wet exposure to further extend ASML's industry leading productivity to 131 wafers per hour (125 exposures).
To support the 40-nm production application, overlay performance is further enhanced.
The proven in-line catadioptric lens design ensures reticle compatibility with previous systems.
While the XT:1700i is ideally suited for volume production at the 45-nm node and is currently being shipped in volume to customers, the XT:1900i will specifically enable volume production for logic devices down to 32 nm and memory devices at 40 nm and below.
ASML expects to begin shipping the XT:1900i by mid 2007.
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