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Extreme ultraviolet lithography expands

An ASML product story
Edited by the Electronicstalk editorial team Oct 18, 2006

ASML and its partners in the semiconductor lithography supply chain have provided an update on their progress towards the commercialisation of extreme ultraviolet lithography.

ASML Holding (ASML) and partners in the semiconductor lithography supply chain have provided an update on their progress towards the commercialisation of extreme ultraviolet (EUV) lithography.

In August 2006, ASML shipped the industry's first full-field EUV exposure tools to R and D centres in Europe and the USA.

The shipments of these alpha demo tools followed ASML's demonstration of key lithography performance targets for EUV development, including full-field imaging and overlay.

In addition, ASML has received the first order from a customer for a pre-production EUV system.

"The delivery of our EUV Alpha Demo Tools and the milestones reached by our EUV-partners will support further development of EUV technology", said Martin van den Brink, Executive Vice President, Marketing and Technology, ASML.

"EUV preproduction tools could be shipping as early as 2009 if customers need them".

Gathered for the 2006 International Symposium on Extreme Ultraviolet Lithography, several industry leaders highlighted their respective EUV technology progress in areas that are critical to EUV development and its eventual commercialisation.

Together, these suppliers are striving to ensure that EUV lithography will become a viable exposure technology for the 32nm node and below.

Carl Zeiss SMT has successfully manufactured the optical trains for the ASML alpha demo tools, having met all key specifications.

The entire EUV optics infrastructure has been built, and technology development in mirror fabrication, coatings, mechatronics, and system metrology is on track for the shipment of EUV production tool optics near the end of the decade.

Cymer is committed to the commercialisation of EUV source technology for high-volume manufacturing lithography applications beginning with the 32nm node in 2009.

Significant advances in laser produced plasma (LPP) technology have been realised that indicate scaling to meet the performance and reliability requirements of a commercially viable EUV production tool, will be achieved in the required timeframe.

In addition to many Cymer specific innovations, they have established partners to create an industry infrastructure for the production of key components such as normal incidence collectors to insure availability of all required critical technology.

Philips Extreme UV supplied the two EUV sources for the ASML alpha demo tools, which will provide the data needed to prepare EUV sources for high volume manufacturing.

The company continues to improve the power output of its sources based on its inherently scalable architecture.

Production-worthy reliability is the next challenge for source providers.

Early results show that Philips' electrode concept allows for this.

Rohm and Haas Electronic Materials said that it has achieved major breakthroughs this year.

"The selection of our MET-2D photoresist for use in ASML's alpha demo tool easily demonstrated 40nm, 1:1 feature resolution", said Jim Thackeray, Rohm and Haas Electronic Materials Technology Fellow.

"In addition, we've developed resists that extend line/space resolution to 35nm, contact hole resolutions to sub40nm, and a chemical amplification resist with 25nm resolution".

Toppan Photomasks, as the supplier of photomasks for ASML's EUV alpha demo tools, is committed to working with the lithography supply chain on the continued development of EUV technology.

"We are confident that through continued collaboration with our customers, technology leaders such as ASML and other companies, we will be able to provide a high-quality, commercial supply of EUV masks in support of the industry's roadmap", said Franklin Kalk, Executive Vice President and CTO.

European light source supplier Xtreme Technologies reported that following delivery of its commercial discharge produced plasma (DPP) EUV sources in 2003, it has continued within a Eur 10 million programme to build integrated source/collector solutions delivering usable intermediate focus power in the 10W range.

Shipment of first units will start in December 2006.

In addition Xtreme Technologies is pursuing its high power concept targeting a volume production worthy 100W EUV source design to be introduced in 2008.

Some of the EUV R and D programmes in Europe have been organised through Medea+, a European program funded by national governments of the Netherlands, Germany, France and Belgium; and the IST programme known as More Moore supported by the European Commission, involving more than 100 companies, institutes and universities.

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