Product category:
Electronics Manufacturing Materials and Consumables
News Release from: ASML
Edited by the Electronicstalk Editorial
Team on 20 December 2006
Acquisition enhances semiconductor
support
ASML is to acquire Brion, a leading provider of semiconductor design and wafer manufacturing optimisation solutions for advanced lithography.
ASML Holding and Brion Technologies have signed an agreement for ASML to acquire privately held Brion, a leading provider of semiconductor design and wafer manufacturing optimisation solutions for advanced lithography Brion's computational lithography technology enables semiconductor manufacturers to simulate the realised pattern of integrated circuits and to correct the mask pattern to optimise the manufacturing process and yield
This article was originally published on Electronicstalk on 13 Jul 2006 at 8.00am (UK)
Related stories
ASML expands immersion product suite
ASML expands immersion product suite with introduction of advanced 40nm immersion system
Scanner brings new resolution to KrF technology
KrF lithography system is claimed to significantly reduce operating costs by covering resolutions that previously required more expensive ArF technology.
Founded in 2002, Brion is a leader in the rapidly growing field of computational lithography which encompasses design verification, reticle enhancement technologies and optical proximity correction.
Subject to approval by regulatory authorities, closing is expected in the first quarter 2007.
Following completion of the acquisition, Brion will continue to support its current product offering and operate as a wholly owned subsidiary of ASML.
Further reading
EMS solutions to be introduced in Munich
IMI or Integrated Microelectronics will showcase its complete solutions in electronica 2004 Trade Show from 09 to 12 November in New Munich Trade Fair Centre in Germany.
Power semiconductor materials focus of trade show
At the 37th International Symposium on Microelectronics November 16-18, 2004, Indiumıs exhibit will focus on Power Semiconductor Materials, such as Solder Wire, Solder Preforms and Solder Paste.
"This combination extends significantly ASML capabilities to support the semiconductor industry as our complementary technologies can enhance further the efficiency of chip manufacturing", said Eric Meurice, President and CEO of ASML.
"Brion's simulation technology combined with ASML's lithography systems will generate value for customers through faster time to market, better imaging quality and higher yield in wafer manufacturing".
"This acquisition reinforces ASML's growth and value potential as our customers require increasingly advanced lithography tools integrated with optimisation capabilities in the race toward the newest chip designs and most advanced technology nodes".
"Joining forces with ASML enables Brion to reinforce its technology leadership in computational lithography while increasing its reach and creating an opportunity for potentially accelerated growth for our products addressing the most advanced semiconductor nodes", said Eric Chen, CEO of Brion.
"This combination represents an unprecedented synergy of wafer manufacturing technologies with multiple areas of co-operation to make our products even more effective".
"We remain committed to delivering an extended suite of computational and wafer lithography solutions to our customers as we become integrated with and supported by the world's leading semiconductor scanner manufacturer".
ASML will pay US $270 million (approximately Eur 203 million) in cash to acquire Brion.
Other details of the transaction were not disclosed.
Notwithstanding the operational results of Brion during 2007, ASML estimates noncash acquisition accounting related charges of approximately Eur 29 million after tax in 2007.
ASML also expects Brion to be cash positive in 2007.
• ASML: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

