Product category:
IC and Hybrid Processing Equipment
News Release from: Assembléon | Subject: Wafer feeder for Topaz-XiII and ACM
Edited by the Electronicstalk Editorial
Team on 10 June 2002
Wafer feeder puts dice onboard
Assembleon has a new wafer feeder option for its Topaz-XiII and ACM component placement machines.
Assembleon has a new wafer feeder option for its Topaz-XiII and ACM component placement machines Representing an important breakthrough in medium-volume die placement for SMT and semiconductor industries, the new feeder enables manufacturers to bring wafer feeding online at lowest cost per placement
This article was originally published on Electronicstalk on 9 May 2002 at 8.00am (UK)
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Assembleon's release of an enhanced Topaz-X component mounter further strengthens the company's position in the medium-volume SMT assembly marketplace.
Assembleon offers a unique solution with the flexibility for processing boards populated with both bare dies and conventional SMDs at minimal incremental cost and with high throughput.
Implemented on the Topaz-XiII, the new feeder delivers bare-die placement speed of around 6300 components per hour with an accuracy of 20 micron at 1 sigma.
The ACM with wafer feeder can place up to 3000 components per hour with an accuracy of 3 micron at 1 sigma.
This combination of accuracy and speed is unmatched by any other mounter in the mid-volume market.
A number of feeder design elements contribute to this output advantage.
Wafers are indexed at high speed.
A sophisticated die push-up unit transfers the bare die from the wafer to the nozzle of the placement robot with less than 300ms die-to-die cycle time and bad mark sensing.
A wafer exchange time of two seconds, and capacity for accommodating up to 20 wafers, ensures high-efficiency operation with little operator intervention.
Furthermore, the wafer feeder handles wafers from five to eight inches (configurable), and five toolbits cover a range of die sizes from 2.5 to 18.0mm square and 0.07 to 0.5mm thickness.
Assembleon's Topaz-XiII and ACM are both highly versatile machines placing a wide range of SMDs and odds with high precision.
With up to four wafer feeders per machine, easily and quickly installed via a simple mechanical and electronic interface, high volume die placement is now easier than ever and inexpensive, lowering the total cost of production.
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