Mounting platform to show its flexibility
Flexibility will be the keyword on Stand 179 in Hall A4 at Productronica 2003.
Flexibility will be the keyword on Stand 179 in Hall A4 at Productronica 2003, where Assembleon will deliver a demonstration of how electronics manufacturers in the 45,000 to 150,000 components per hour throughput range will be acquiring SMT production capacity over the next decade.
A stunning 3D vision experience - "The next dimension" - is a must-see for any manufacturer looking for a head start in the race to market supremacy as the industry emerges from the downturn.
The real thing is the centrepiece of the working demonstrations.
The A-series component mounting platform is not just a pick-and-place machine but a comprehensive placement platform offering a uniquely flexible solution for 45,000 to150,000 components per hour (IPC specification 30,000 to 100,000 components per hour) high-mix SMT applications at the same footprint.
Modularity is the key concept in optimum long-term solutions available at minimum initial and incremental investment levels.
The A-series takes to the ultimate Assembleon's TrueModularity concept, whereby automated calibration delivers technology and volume scalability for line reconfigurations in just a few minutes.
One-minute changeovers are supported by self-calibration and generic transport and board support.
With this new system, Assembleon take the modular platform to unprecedented heights of flexibility and efficiency, and once again sets a new standard in pick-and-place performance worldwide.
Application scalability is achieved by blending proven, best-in-class chipshooter and fine-pitch placement technologies to handle all placement requirements, from 01005 through ICs and advanced packages to odd forms.
Appropriate placement technology per component is automatically selectable through sophisticated optimisation software to handle accuracy classes down to 25um at 4 sigma (IPC specification).
Although dedicated technologies are employed where required, commonality is invoked in the user interface, operation, feeders, utilities, and maintenance.
Therefore the A-series looks and feels like a single, small-footprint machine, with flexibility of placement heads handling more than 300 part numbers for the platform.
The fastest-ever setup, changeover and MTTR on an SMT placement platform, together with impressive throughput performance and a uniquely small footprint, ensure that profit per placement on the A-series is unbeatable.
The A-series' three versions will be demonstrated on-stand.
The AX-3 and AX-5 frames support TrueModular plug-and-play interfaces to pick-and-place robots, with capacity expansion/contraction in 7500 components per hour (IPC specification 5000 components per hour) steps.
Each frame can be equipped with two types of placement robots featuring revolutionary pick-and-place heads with onboard artwork recognition vision system and second-generation laser alignment for improved speed and accuracy in placing components.
These new systems also automatically control the component pick performance, as well as machine calibration.
The configuration starts with an AX-3 three-segment frame delivering 45,000 components per hour throughput, and can be expanded indefinitely.
AX-3 and AX-5 (five-segment frame) can be integrated with the AQ-1 frame, which is configurable for any application to place any type of advanced component up to flip-chips and even odd forms (including through-hole components).
Programmable servo control, including real-time force control on the z-axis, ensures that all components are placed with the appropriate z-axis force.
Also on-stand will be the latest generation of Assembleon's high-performance GEM-XII placement machines, which take output up to the bottom end of the A-series range and are feeder and software compatible to deliver versatile solutions to any mid-range production requirement.
The range now includes the Opal-XII, offering a level of functionality which is exceptional at its price level.
Startup operations, and other smaller SMT manufacturers requiring a high feeder count and placing a wide range of component types, stand to benefit from this competitively priced machine with built-in expandability.
Enabling manufacturers to satisfy all their component placement requirements with a single machine, the Opal XII accommodates up to 100 x 8mm tape feeders.
It offers a choice between a 45mm line array camera as standard and optional area CCD cameras, enabling placement of components from 0201 to 45 x 45mm BGAs, flip-chips, CSP, connectors and odd forms.
Accuracy is up to 55um at 4 sigma, and maximum throughput 11,500 components per hour.
Important features of the Opal XII are a graphical user interface recognised as one of the best in the industry, expandability via the addition of placement heads for more speed, a second Opal XII or other Gem machine/s for volume or application flexibility with feeder and software compatibility, or extended tray handling.
Assembleon will also be showing advanced feeder technology which boosts the capacity and performance of the A-series.
An innovative twin tape feeder sets a new standard in optimised, efficient and intelligent tape feeding.
The unique feeder design, based on DTSS dual tape single slot technology, enables the user to implement high-density 8mm SMD tape component part numbers on the A-series.
The new feeder technology supports lean manufacturing by enabling users to fulfil their placement requirement with the highest output on the smallest footprint.
The availability of additional lanes improves component balancing, even further reducing cycle times.
Expanded feeder capacity provides opportunities for family setup, with faster changeovers adding to efficiency and cycle time benefits.
Twin-tape feeder technology will soon also be made available for 12mm taped SMD components.
This improvement will allow components in 12mm tape to be processed with no feeder space penalty.
Integrated intelligence allows zero-error setup, lot traceability, internal diagnostics, empty-reel advanced warning and repair history, and is splice detection prepared.
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