Product category:
PCB Assembly Equipment and Tools
News Release from: Assembleon | Subject: AX-3 SMD placement system
Edited by the Electronicstalk Editorial
Team on 11 April 2005
Parallel placement concept delivers high
uptime
Assembleon is showing its advanced AX-3 SMD placement system at Elkom 2005 in Helsinki.
On Booth K35 in Hall 6 at Elkom 2005 (from 19th to 21st April at the Helsinki Fair Centre), technology leader Assembleon is showing its advanced AX-3 SMD placement system The AX-3 chip and IC placer provides easily expandable placement capability for mid- to high-volume high-mix manufacturing
This article was originally published on Electronicstalk on 4 Jun 2008 at 8.00am (UK)
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Platform boosts placement density
With a space productivity of 20,000 components per hour per square metre the MC-12 is reckoned to be the most productive pick-and-place machine on the market.
The AX-3 handles components from 01005 to ICs such as QFP, BGA and CSP with dimensions up to 45 x 45mm, with no slow down for even the largest.
Its configuration can be optimised for each new production batch without the need for changing placement heads, or any other type of machine reconfiguration.
The AX-3 offers an attractive pattern of investment with expandability in 5000 component-per-hour increments from 30,000 to 110,000 components per hour (IPC9850) on the same small footprint.
Relatively low-speed movements offer a highly controlled pick-and-place process, resulting in unsurpassed placement accuracy, quality and repeatability.
In addition, stress free operation results in very high durability and low machine maintenance requirements.
Complementing this with calibration-free reconfiguration, fast setup and replace-not-repair maintenance, the parallel placement concept delivers the highest uptime in the industry and lowest cost of operation.
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