Semiconductor packages in ceramic and metal
An
Atek Technology product story
Edited by the Electronicstalk editorial team
Sep 24, 2002
High-performance and custom-designed packages in ceramic and metal are now available from Atek Technology.
High-performance and custom-designed packages in ceramic and metal are now available from Atek Technology.
Using the latest in ceramic design and lightweight, high thermal packaging concepts, along with conventional glass to metal seal technology, these cost effective packages are made by Ixion Technologies, leaders in package design and development.
Produced quickly and efficiently to meet the needs of high-power semiconductor, microelectronic and high-speed communications applications, they are ideal for use in fibre optic communications, launchers, detectors and other active systems, high power devices and hybrid systems.
Featuring low cost leaded surface mount packages for application-specific components, the range also includes microwave and RF transistor packages as well as semiconductor and MCM packages.
Not what you're looking for? Search the site.
Contact Atek Technology
Related Stories
- Tirna releases flexible analogue filter module
- Hios BL electric screwdrivers are ESD safe
- IMI and Validus release powered card
- Manncorp releases baking dry boxes
- OK offers part-exchange deal on its Metcal system
Categories
- Active Components (11,917)
- Passive Components (2,949)
- Design and Development (9,394)
- Enclosures and Panel Products (3,246)
- Interconnection (2,841)
- Electronics Manufacturing, Production, Packaging (3,055)
- Industry News (1,898)
- Optoelectronics (1,616)
- Power Supplies (2,297)
- Subassemblies (4,551)
- Test and Measurement (4,956)
