MIMO chip packages three transceivers in one

Athena Semiconductors and Samsung Electronics have developed the world's first three-transceiver RF device for MIMO in a single IC.

Athena Semiconductors and Samsung Electronics are claiming a breakthrough product for the emerging wireless Multiple Input Multiple Output (MIMO) standard by developing the world's first three-transceiver radio frequency (RF) device for MIMO in a single integrated circuit (IC).

Other products require multiple devices and therefore a larger footprint.

This next generation device offers the smallest footprint that even rivals existing legacy wireless standard footprints while offering compelling cost, power and seamless integration advantages.

The tight integration of the single-device, called Trini, dramatically undermines the cost of all other solutions, which require multiple devices to implement MIMO applications.

The small footprint and cost rivals even that of existing wireless device solutions, making a compelling case for implementation of MIMO-based products now to realise dramatic bandwidth and reach performance benefits promised by MIMO technology.

At the heart of Trini is OptimRF technology that Athena Semiconductors pioneered to build high performance CMOS RF transceivers at low cost.

OptimRF transceivers use Athena's patent-pending, modified direct conversion architecture designed for extensive digital calibration at system level.

It results in OptimRF transceivers delivering high performance at low cost due to an increase in the yield of functional RF chips.

The newly developed, OptimRF-based three-transceiver ICs aid in fulfilling MIMO's capabilities of providing a datarate that is far higher than existing 802.11a/g standards-based equipment, increasing from 54 to more than 200Mbit/s, opening up new markets for wireless vendors.

All the while, original equipment and original design manufacturers (OEMs and ODMs) implementing the Trini can realise significant go-to-market advantages from this smaller footprint single-device.

Use of familiar CMOS technology provides a low power-consumption, low-cost solution for MIMO implementations that also enables seamless integration all with a single device.

Athena Semiconductors and Samsung Electronics will demonstrate this breakthrough technology at the Consumer Electronics Show (CES) in Las Vegas.

The demonstration will show consistent link throughputs in excess of 50Mbit/s.

A transmission of two simultaneous high definition television (HDTV) streams and a single standard definition television stream will be demonstrated to illustrate the product's feature set.

The Trini will be available from Athena Semiconductors to select OEM and ODM partners in Q1 of 2005 and will be in mass production for availability to the general market in Q2 of 2005.

Pricing will vary by quantity.

"We're very excited about the Trini device created by Athena Semiconductors working closely with Samsung's Digital Media R and D team", said Dr JaeMoon Jo, Vice President of Samsung Electronics.

"Our ability to jointly develop the market's first single-device three-transceiver MIMO solution is a testament to the innovation, vision and capabilities of both companies".

"Samsung has aggressively participated in the IEEE committee to help develop the MIMO-based 802.11n standard that is expected to be widely used in Samsung consumer equipment in the future".

"Athena's single-chip three-RF transceiver solution will significantly lower the cost/area/power of 802.11n standard based implementations and will help fuel the growth of 802.11n".

"We look forward to seeing the worldwide adoption of 802.11n-based products in environments demanding the Wi-Fi bandwidth that MIMO promises to deliver".

"We've achieved a true milestone with Samsung, for MIMO and for wireless access products to deliver the solid bandwidth that MIMO promises", said Pratap Reddy, President and COO, Athena Semiconductors".

"The high levels of integration we've achieved enable extremely competitive pricing that make this solution viable today, even rivaling price points of existing WLAN access devices".

"We are excited to have Samsung Digital Media group as a user and partner in the development of this MIMO RF chip".

"We will also make the solution available to all OEM, ODM and other design houses worldwide".

Back to top