Serial EEPROMs come in low-profile 8-pin packages

The novel XDFN package is ideal for height-constrained comms applications such as headsets, wireless LAN adapters and Bluetooth modules.

Atmel has come out with the industry's first 128Kbit serial EEPROM device in an 8-pin XDFN package with overall z-height of just 0.40mm.

Building on Atmel's robust serial EEPROM DFN (dual footprint nonleaded) portfolio, the XDFN package will accommodate the industry movement toward applications with the most stringent space constraints.

The 8-pin XDFN (1.8 x 2.2 x 0.40mm) package is now offered in two-wire serial EEPROM (AT24) and SPI serial EEPROM (AT25) protocols: two-wire serial EEPROM densities range from 1 to 128Kbit and SPI densities range from 1 to 16Kbit.

The innovative XDFN package is ideal for a wide range of height-constrained communication applications including headsets, wireless LAN and Bluetooth modules.

Atmel is the first to market a serial EEPROM device in a 0.40mm height leadless package, looking beyond industry standard SOIC and TSSOP offerings.

"Our leading edge technology enabled us to accomplish such a breakthrough in package technology", says Jeff Takahashi, Director of Marketing for the Serial Interface Product Line.

"Reduction of component packaging to fit into smaller application form factors is a continuous trend in the market place and with our XDFN package we are offering a migration path for storage from 1 to 128Kbit with the smallest package height available (0.40mm) in a serial EEPROM device", adds Takahashi.

The XDFN (1.8 x 2.2mm) package is now available in volume production in densities from 1 to 128Kbit in the two-wire serial EEPROM (AT24) and from 1 to 16Kbit in the SPI serial EEPROM (AT25) family.

The 8-pin XDFN package is offered in Pb-free (green)/halogen-free and RoHS compliant packaging with the industry's high reliability NiPdAu finish.

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