DRAM proves to be logical in SoC designs
Atmos has announced immediate availability of its system-on-a-chip (SoC) pure logic IP core, SoC-RAM PL.
Atmos has announced immediate availability of its system-on-a-chip (SoC) pure logic IP core, SoC-RAM PL.
The SoC-RAM PL core permits system-on-a-chip designers to embed large instances of dynamic random-access memory (DRAM) in semiconductors using standard CMOS logic processes instead of expensive specialised merged logic processes.
Target applications for the Atmos SoC-RAM core include ADSL and cable modems, digital camcorders, printers, PC graphics cards, routers and Gigabit Ethernet switching systems.
The Atmos SoC-RAM embedded memory core uses intelligent software optimisation, allowing engineers to configure memories via the Internet before committing them to a design.
This flexible design experimentation allows engineers to establish the optimum architecture, fine-tune their floorplan, and thereby iterate their design until the required system performance is achieved.
Designers require large amounts of embedded memory to meet their system performance requirements.
Until the introduction of SoC-RAM PL, the main alternative for large memory instances was static RAM; however, they consume much more power and area than an embedded DRAM design.
Another option is off-chip memory, but this requires routing signals to multiple chips and therefore cannot meet the performance goals of today's wireless and highly mobile devices.
A third alternative is to use cumbersome fixed-size memories, called "tiles", or to engage a specialty design house to create a fully custom design.
Robust, easy to integrate DRAM IP available in standard logic processes provides high performance while utilizing far less power and area than any of the alternatives.
Atmos permits designers to innovate DRAM instances specifically tailored to meet their system's architectural requirements.
Because, ATMOS delivers memory instances immediately over the web, the memory design timeline is eliminated from a project's critical path.
"Embedded DRAM is a fundamental technology that will enable SoC designers to reach performance levels as yet unheard of", said Dr Paul Slaby, president and CEO of Atmos.
"From PDAs and 3G cell phones to routing and classification, designers need multiple megabits of memory on chip to achieve sustainable competitive advantage in their target markets.
Atmos provides a solution that is efficient in its time savings and performance delivery".
Atmos SoC-RAM PL test chips are manufactured by TSMC in a 0.18um CMOS logic process.
The Atmos SoC-RAM core is available now.
The ATMOS web site contains sample data sheets of three SoC-RAM cores: a 3Mbit DRAM with 96bit I/O with four banks; a 5Mbit DRAM with 212bit I/O and 12 banks; and an 8Mbit DRAM with 256bit I/O and 16 banks.
These SoC-RAMs can be used as design examples or can be customized to meet various system requirements.
Prices for the SoC-RAM IP vary according to customer requirements for design support and volumes.
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