Product category:
Embedded Computing and Control
News Release from: Axiomtek | Subject: CEM830
Edited by the Electronicstalk Editorial
Team on 01 May 2007
COM Express module is Core2 Duo
supercomponent
High performance Intel Core2 Duo COM Express module is designed to appeal to a wide range of vertical embedded markets.
New from Axiomtek, the CEM830 is a high performance Intel Core2 Duo COM Express module designed to appeal to a wide range of vertical embedded markets Packed as a supercomponent, it is designed to be futureproof and to provide a smooth transition path from parallel PCIbus to serial PCI Express buses
This article was originally published on Electronicstalk on 11 May 2007 at 8.00am (UK)
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Dual-core computing suits a range of applications
Axiomtek's CEM830 computing platform supports dual-channel DDR2, PCI Express x16, and 8 high-speed USB 2.0 ports.
Embedded box promises rugged performance
Fanless application-ready embedded system features a novel antivibration mechanism, excellent thermal performance and optimised expandability.
Rich complements of contemporary high bandwidth serial interfaces include PCI Express, Serial ATA, USB 2.0 and Gigabit Ethernet.
The CEM830 incorporates a high performance graphics controller through a PCI Express x16 interface, and the module supports Socket M type processors with 533/667MHz FSB (front side bus) including Intel Core2 Duo, Core Duo, Core Solo and Intel Celeron M processors.
The COM Express type-II module offers fast time to market with reduced development cost and significant freedom in meeting form-fit-function requirements.
Further reading
Embedded PC runs quietly
The Intel 945GME Express chipset featuring the Intel Graphics Media Accelerator 950 offers enhanced graphics and increased I/O bandwidth.
CPU module saves power in limited space
Full-function PC/104-Plus CPU module combines the fast data throughput of PC104-Plus with many low power features.
COM Express is an open industry standard for computers-on-modules.
It has also been formulated to be applicable to a broad range of form factors, from floor-installed to bench-top to handheld.
Powered by the mobile Intel 945GME+ICH7M express chipset, this CEM830 features PCI Express x16 graphics ports and PCI Express x1 I/O ports, next generation Serial ATA, and eight high-speed USB 2.0 interfaces.
Also a Fast Ethernet port is connected from PCI-E x1 bus (optional Gigabit Ethernet port) for high speed 100 Base-T networking connectivity.
The system memory supports dual 200-pin DDR2 SODIMMs up to 3Gbyte.
Onboard SMBus support is provided for battery monitoring.
"The CEM830 has extended power-management capability".
"With robust thermal and mechanical concept, legacy-free design, and super compact module size, the CEM830 module enables customer's embedded devices lightly is applied in various applications; such as healthcare, retail and advertising, test and measurement, gaming, entertainment, industrial automation, security, and unmanned vehicles and more", says Joseph Chou, Product Manager of Embedded Computing Division.
High performance mezzanine connectors with several pinout types cover a wide range of embedded applications.
32bit PCI, LPC and Parallel ATA options are also offered for easy interfacing to various peripherals.
In addition, the CEB94000 COM Express development baseboard is available, with a standard ATX form factor, and providing flexible expansion with PCIe x16, PCIe x1 and 32bit/33MHz PCIbus.
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