Product category:
Design and Development Software
News Release from: BAE Systems Aerospace Controls
Edited by the Electronicstalk Editorial
Team on 30 June 2005
NASA finances low-temperature IC
research
BAE Systems has received a $12.5 million contract from NASA for research and development of extreme temperature technology.
BAE Systems has received a $12.5 million contract from the US National Aeronautics and Space Administration (NASA) for research and development of extreme temperature technology BAE Systems' Manassas, Virginia facility will explore techniques to extend the performance range of semiconductor devices that will enable NASA to continue exploring and examining the surfaces of the Moon and Mars
This article was originally published on Electronicstalk on 30 Sep 2003 at 8.00am (UK)
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This technology will allow data gathering in the extreme temperatures of space without providing additional and costly protective systems required to maintain the operating temperature of the semiconductor devices.
Through a combination of process and device modifications, the basic semiconductor device will be modified to operate at temperatures as low as -230C.
The modified device can then be used to design custom application-specific integrated circuits (ASICs) that will operate at extreme temperatures without external protective measures.
"This research will enable NASA's continued exploration of the universe and we're delighted to play a role", said Ted Jamba, BAE Systems' Programme Manager at Manassas, Virginia.
BAE Systems has a 20-year history of providing radiation-hardened solutions for US space programmes.
Its RAD6000 computers were installed on each of the still-operating Mars Rovers - the only control and data computers aboard the two Rovers - to execute flight, landing and exploration operations on Mars.
The RAD750 represents the next-generation of space microprocessors, and was first launched onboard NASA's Deep Impact mission - which is expected to get an up-close view of comet Tempel 1 on 4th July 2005.
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