Alliance brings strippers and cleaners to Europe

Dynaloy and BASF have entered into an expanded sales and distribution agreement for strippers and cleaners used in the IC industry for wafer level packaging and bumping steps.

Dynaloy and BASF have entered into an expanded sales and distribution agreement for strippers and cleaners used in the IC industry for wafer level packaging and bumping steps.

This agreement will enrich BASF's product portfolio for the semiconductor industry and will give Dynaloy access to key markets in Asia and Europe.

The new agreement is a further step in BASF's expanding activities in the electronic materials markets.

It targets the area of wafer level packaging, which is one of the final steps in microchip production that uses contact pads rather than pins or wires to connect integrated circuits.

Dynaloy has developed a broad portfolio of innovative and specialised chemical formulations for this process.

"With Dynaloy, BASF has a partner that can adjust its product offering to the ever changing requirements of the industry and is able to customise products to meet the latest requirements", said Dr Karl-Rudolf Kurtz, Group Vice President of BASF's Global Business Unit Electronic Materials.

Donn Detzler, President of Dynaloy added: "BASF is the ideal partner for Dynaloy to provide the necessary technical support associated with our products with fast response to customer issues due to local presence and lab capabilities".

BASF has a long-standing experience in the area of high purity chemicals and tailor-made formulations for the semiconductor and flat panel display industry.

Dynaloy has advanced technology and specific products in the field of wafer level packaging.

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