Product category:
Electronics Manufacturing Materials and Consumables
News Release from: BASF | Subject: Ultramid T 4381 LDS
Edited by the Electronicstalk Editorial
Team on 26 March 2007
Laser-structurable polyamide makes 3D
circuits
Kromberg and Schubert has developed the first 3D-MID electronic components made of BASF's new laser-structurable polyamide.
Kromberg and Schubert, an automotive supplier based in Renningen, Germany, has developed the first 3D-MID electronic components made of BASF's new laser-structurable polyamide: the conductors are integrated directly into the surface of three-dimensional moulded interconnected devices (MIDs) The new Ultramid T 4381 LDS lends itself extremely well for such mechatronic components
This article was originally published on Electronicstalk on 19 Oct 2006 at 8.00am (UK)
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This partially crystalline, partially aromatic high-temperature polyamide 6/6T is reinforced with 10% glass fibres and 25% mineral fillers, offering a much broader processing window for the metallisation, but without damaging its mechanical properties.
This plastic was further improved as to the metal layer adhesion and deposition rates and was optimised with regard to the novel method of laser direct structuring (LPKF-LDS).
"Three-dimensional moulded interconnected devices are soldered lead-free".
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"In this process, the component has to withstand a temperature of 245C, which calls for a sufficiently heat-resistant plastic", explains Erik Rega, MID Manager at Kromberg and Schubert.
The entire contacting is embedded into the 3D-MID, so that there is no need for any wiring at all.
This is a very efficient method, with a vast potential for miniaturisation in automotive electronics.
Outstanding properties of the new material Ultramid T 4381 LDS in this application are its high melting point of 295C and its high flexural temperature of about 260C under a load of 0.45MPa.
Without load, this material can withstand temperature peaks up to 285C.
This means that it is the right choice wherever electronic components have to be soldered; it also allows the use of lead-free solder, clearing the way for even higher soldering temperatures.
The base polymer Ultramid T, an engineering plastics specialty, is already used in electronics and automotive construction whenever particularly high demands are made in terms of the heat distortion temperature.
It offers an optimal compromise between high melt temperature, good processability and low water absorption.
This new BASF plastic, which is especially suitable for laser direct structuring, incorporates a laser-sensitive additive that contains metal.
The laser treatment virtually engraves the conductor tracks into the three-dimensional surface of the component.
After that, it is immediately metallised, yielding an optimal adhesion.
Such MIDs that are directly laser structured allow the integration of electronic circuits straight onto plastic surfaces.
In contrast to other methods for producing electronic components, they offer several advantages, including greater design freedom, shorter process sequences, a smaller number of different materials needed and flexibility in changing the circuit layouts.
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