Product category:
Electronics Manufacturing Materials and Consumables
News Release from: BLT Circuit Services | Subject: LFB/227S
Edited by the Electronicstalk Editorial
Team on 12 April 2004
Solder eases switch to lead-free
processing
BLT Circuit Services reports considerable success during recent extended trials with its SAC lead-free low-cost solder called LFB/227S.
BLT Circuit Services reports considerable success during recent extended trials with its SAC lead-free low-cost solder called LFB/227S While testing with a large UK wave soldering machine manufacturer this nonpatented solder produced excellent results on a variety of PCBs, and BLT believes this would be a sensible choice of lead-free alloy for most users and could be a good contender as a drop in replacement against the standard 63/37 alloys currently used, while enjoying significant savings against other patented lead-free SAC alloys
This article was originally published on Electronicstalk on 6 Dec 2004 at 8.00am (UK)
Related stories
Swabs simplify RoHS compliance verification
BLT Circuit Services has become the European distributor for LeadCheck swabs.
Kits offer handy check for RoHS compliance
The latest Indirect LeadCheck kit includes fine tipped Q-tips, alcohol wipes, sample trays and 24 LeadCheck swabs all in one convenient kit.
Manufactured in house using nitrogen casting techniques, the alloy has special dross-inhibiting properties and flows similarly to higher-silver-content SAC alloys, while producing little dross and using conventional wave soldering techniques with no need for an inert nitrogen atmosphere around the pot or preheat stages.
In tests the alloy, which is based on Sn/Ag/Cu/P, ran at only 10C hotter than normal leaded solder (260C), and produced very good results with industry-standard alcohol- and VOC-free fluxes.
Subsequently, for most BLT users there will be no need to change flux formulations, which will be one less process concern.
With considerably less silver content it is expected the savings to be made compared to normal SAC alloys will be in the region of 30% or more, while offering similar wetting speeds and a saving on dross scrap compared with other Sn/Cu alloys.
The alloy produced significantly improved solder wetting and flow characteristics compared against tin/copper formulations and is very tolerant to both silver and copper contamination, with a need to make simple additions to the alloy with a special stabilising metal once levels of copper exceed predetermined limits.
Regular solder analysis is recommended to ensure the stability and mix of LFB/227S, which is carried out in the BLT laboratory.
Further details will be available at the Nepcon show in Brighton.
• BLT Circuit Services: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
