Product category:
Communications ICs (Wireless)
News Release from: Broadcom Corp
Edited by the Electronicstalk Editorial
Team on 13 February 2007
3GSM showing for 65nm handset devices
Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain.
Broadcom is showcasing new 65nm products for mobile handsets and handheld devices at this week's 3GSM World Congress in Barcelona, Spain With the industry's broadest communications IP technology portfolio, coupled with new 65nm technologies, the demonstrations at 3GSM illustrate how Broadcom has squeezed a greater number of robust features within smaller board spaces and slimmer mobile handset designs
This article was originally published on Electronicstalk on 19 Oct 2005 at 8.00am (UK)
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Featuring the industry's highest integration, lowest power consumption, smallest size and lowest bill of materials (BOM) available, Broadcom's new 65nm mobile and wireless products are all available today.
The 65nm process is the most advanced lithographic node for manufacturing semiconductors in large volumes today and provides significant benefits over 90nm and 130nm processes by enabling lower power consumption, smaller size, higher yields and higher levels of integration.
For Broadcom, the move to 65nm process technology is changing the competitive landscape because of the breadth and depth of the communications intellectual property the company possesses.
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Without a broad portfolio of market-leading solutions to integrate, competitors are not able to take full advantage of the benefits that these next-generation processes provide.
Broadcom's vast communications intellectual property for transporting voice, video and data at home, work and on-the-go are helping to enable customers and service providers with a truly seamless communications experience for end users worldwide.
"Broadcom is making good on our promise to deliver the most advanced solutions for tomorrow's converged mobile devices, enabling us to establish a leadership position in new markets, as well as strengthening our positions where we already have dominance", said Vahid Manian, Senior Vice President of Broadcom's Global Manufacturing Operations.
"At 3GSM, we are demonstrating available 65nm solutions that build on our track record of superior technical innovation while facilitating the next step in wireless convergence with unprecedented levels of integration".
Portable mobile device manufacturers and service providers are working aggressively to launch next-generation products and services using Broadcom advanced 3G and 2G cellular and related connectivity solutions.
At this week's 3GSM World Congress, Broadcom will demonstrate a CMOS Edge radio, advanced HSDPA baseband processor chips, an ultra low power Edge processor that integrates the radio and helps extend battery-life, and a multi-function connectivity solution that combines Wi-Fi, Bluetooth and FM receiver technologies onto a single silicon die.
With these advancements, Broadcom's 65nm solutions enable such cutting-Edge features as mobile TV, high-speed Internet access, MP3 support, PVR video playback, camcorder capabilities, and more.
The desire to bring all of this functionality within a single, compact-size device with longer battery life, is helping to guide Broadcom's R and D investments from a product and intellectual property perspective.
With a diverse communications portfolio from its broadband communications, enterprise networking and mobile and wireless groups, Broadcom is accelerating next- generation 65nm processes to produce a family of solutions that no other silicon vendor is able to provide.
Over the past month, Broadcom has introduced a variety of 65nm SoC solutions well in advance of competitive rivals.
Many semiconductor vendors depend on their foundries and fabrication houses to transition from one geometry process to another, which includes re-tooling design libraries to the advanced process.
On the other hand, Broadcom completed these efforts internally, resulting in a much faster time to market and an opportunity to drive widespread adoption of 65nm solutions.
As a further competitive differentiator, 65nm solutions developed by Broadcom can be produced by a number of qualified foundries providing manufacturing flexibility while eliminating single-source dependence.
Highlighting the company's position as a cellular technology innovator for advanced mobile devices, the following 65 nanometre products are now available and will be demonstrated at 3GSM.
Broadcom's new BCM21331 Edge processor combines the key components needed for advanced multimedia phones on a single monolithic chip.
Designed in a 65 nanometre CMOS process, the new Edge processor fully integrates an Edge radio frequency (RF) transceiver, all of the analogue and digital baseband functions, and enhanced multimedia support.
It accommodates small board spaces and slim designs and features the highest integration, lowest power consumption and lowest bill of materials (BOM) available.
This Edge processor provides a new level of affordability for the largest segment of the handset market.
The BCM2153 is the industry's first solution for mobile handsets that integrates a High-Speed Downlink Packet Access (HSDPA) baseband modem with a world-class multimedia processor on a single monolithic chip.
The new mixed-signal device is the first developed in a 65 nanometre CMOS process and integrates a complete Category 8 HSDPA modem that delivers 7.2Mbit/s of third generation (3G) connectivity for advanced applications.
With this level of integration, the new HSDPA processor requires less board space, costs less and consumes less power than competing two-chip solutions, enabling high-end 3G phones at 2G prices.
The BCM2085 is the industry's first 65nm Edge RF transceiver designed in pure digital CMOS.
It integrates all transceiver and analogue baseband functionality to deliver unparalleled savings in power consumption, size and cost.
Combining low power (which helps extend battery-life), high integration and low cost, the BCM2085 is compatible with the most popular cellular basebands and reduces the RF board area by more than 50% for Edge-based mobile handsets and other handheld devices.
The BCM4325 is the industry's most advanced single-chip connectivity solution that combines the company's market-leading Wi-Fi, Bluetooth and FM receiver technologies onto a single silicon die.
This combination of popular radio capabilities in a new ultra low power 65nm CMOS system-on-a-chip allows OEMs to provide the richest connectivity features without a prohibitive impact on product cost, size or battery- life.
No other silicon provider can match Broadcom's positions in both the Bluetooth and Wi-Fi markets, or offer the low power benefits enabled by the advanced 65nm process.
In addition to these new 65nm products, Broadcom has also delivered the BCM3563 1080p digital TV SoC at this year's 2007 International CES in Las Vegas.
The BCM3563 is the industry's first high definition (HD) digital TV silicon solution that supports full 1080p display resolution.
Designed in 65nm process, this new "television-on-a-chip" enables TV and other consumer equipment manufacturers to cost-effectively build TVs and displays with the industry's highest quality HD resolution.
The new device is compatible with the National Television Systems Committee (NTSC) analogue standard, the North American digital terrestrial or Advanced Television Committee (ATSC) digital standard and the digital cable television standard.
In addition, the new chip supports picture-in-picture (PIP) and picture-by-picture display modes.
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