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The Bergquist Company
Address:
Unit 27, Darin Court
Crownhill Industrial Estate
Milton Keynes
MK8 0AD
UK
Telephone: (UK) +44 1908 263663
http://www.bergquistcompany.com
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Listing of all 22 news releases from The Bergquist Company:
Five-wire touchscreens cross the pond
System combines the durability of five-wire resistive technology with flexible offerings to meet the specific requirements of a wide range of applications.
News from The Bergquist Company (13 February 2008)
Thermal interface is easy to apply
Silicone-based glass-fibre-reinforced thermal interface material comes with an optional adhesive coating.
News from The Bergquist Company ( 8 October 2007)
Metal core PCBs keep powerful LEDs cool
Dielectric material answers extreme thermal challenges of applications using high brightness LEDs.
News from The Bergquist Company ( 8 March 2007)
Thermal interface material sticks to its task
Glass-fibre-reinforced silicon-based thermal interface material is designed specifically for high-volume automatic dispensing applications.
News from The Bergquist Company ( 3 October 2006)
Coated thermal plates aid safety-conscious cooling
The IsoEdge range of heatsink products can improve component packaging densities, reduce parts counts and cut the assembly costs of a wide range of electronic products.
News from The Bergquist Company ( 5 June 2006)
Softer gap filler boosts thermal performance
Material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease of use, for demanding applications such as cooling laptop CPUs.
News from The Bergquist Company ( 2 June 2006)
Filler bridges thermal gaps
High-performance, thermally conductive, electrically isolating, liquid gap filling material combines both an excellent conductivity of 3.6W/mK and exceptional softness.
News from The Bergquist Company ( 1 May 2006)
Thermal products add Turkish distribution
Aktif Neser Elektronik a specialist supplier for electronic components, test equipment and systems has been appointed by the Bergquist Company as its new representative in Turkey.
News from The Bergquist Company (12 April 2006)
Thermal interface takes heat off without pressure
Electrically insulating thermal interface material provides exceptionally high thermal performance, particularly in applications which use low contact pressures between components and heatsinks.
News from The Bergquist Company (15 March 2006)
Gap-filling material is easy to apply
Gap Filler 2000 is a high-performance thermally conductive electrically isolating liquid gap-filling material supplied as a two-component room or elevated temperature curing system.
News from The Bergquist Company (22 February 2006)
Insulating thermal interface is naturally tacky
Bergquist's new Sil-Pad 1500ST electrically insulating thermal interface material provides exceptionally high thermal performance, even at contact pressures as low as 69kPa.
News from The Bergquist Company (17 March 2005)
Switches go where no membrane has gone before
Bergquist is using Electronica 2004 for a European launch of its extensive membrane switches capability which can be used in harsh environments that previously required more costly, rugged switches.
News from The Bergquist Company (12 November 2004)
Softest thermal management in sensitive situations
Bergquist has launched its Gap Pad S-Class thermally conductive gap-filling products providing exceptional thermal performance while applying little or no stress to pressure sensitive components
News from The Bergquist Company (12 November 2004)
Green light for thermal substrates
User application article Osram Opto Semiconductors is using Bergquist Thermal Clad IMS technology to deliver effective heat dissipation in the company's latest Trafficsignal range of LED array-based traffic light solutions.
News from The Bergquist Company (29 June 2004)
Label acquisition adds to keypad competencies
The Bergquist Company has acquired Design-Mark Industries, a leading supplier of graphic overlays, labels and decals.
News from The Bergquist Company (30 April 2004)
Easy application for thermal gap filler
A new thermally conductive, nonreinforced gap filling material from The Bergquist Company is designed for mid- to high-thermal-performance applications.
News from The Bergquist Company (21 April 2004)
Substrates simplify thermal management
T-Clad insulated metal substrate technologies can significantly reduce the cost and the complexity of thermal management in high-power-density surface-mount applications.
News from The Bergquist Company (11 February 2004)
Bridge that gap without silicone
A new silicone-free, thermally conductive and electrically isolating gap filling material is designed for use in applications where silicone could contaminate key manufacturing processes.
News from The Bergquist Company (24 December 2003)
Thermal interface material aids rework operations
Hi-Flow 225UF has been developed in response to the high power digital interface market's need for a high-performance, reworkable phase change material.
News from The Bergquist Company (16 July 2003)
Long life for heatsink thermal tape
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
News from The Bergquist Company ( 3 July 2003)
Conductive thermal interface tape aids cooling
Five-wire touchscreens take the tough life
