Product category:
Heatsinks and Thermal Management
News Release from: The Bergquist Company | Subject: Hi-Flow 300
Edited by the Electronicstalk Editorial
Team on 14 May 2003
Conductive thermal interface tape aids
cooling
A new electrically insulating phase-change material simplifies and speeds the implementation of thermal management solutions.
A new electrically insulating phase-change material simplifies and speeds the implementation of thermal management solutions by providing an easy-to-handle thermally conductive and electrically isolated interface between electronic power devices and heatsinks The Bergquist Company's Hi-Flow 300 is an electrically insulating material consisting of a thermally conductive phase change compound coated on two sides of a thermally conductive polyimide film
This article was originally published on Electronicstalk on 22 Oct 2002 at 8.00am (UK)
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The polyimide reinforcement means that the material is much easier to handle than conventional interface alternatives - including grease - and a phase change temperature of 55C minimises shipping and storage problems.
With a thermal conductivity of 1.6W/mK and a dielectric breakdown voltage of 5000V, Hi-Flow 300 offers superior thermal and electrical performance than previously available interface alternatives.
In addition, the thixotropic characteristics of the material ensure total coverage of the interface area without any overflow.
Hi-Flow 300 is ideal for both discrete power semiconductors and modules and is available with standard film thicknesses of 0.25, 0.38 and 0.51mm.
An 'easy-release' liner ensures ease of use in high-volume, manual assemblies.
Bergquist offers Hi-Flow 300 in roll form, sheet form or as die-cut parts depending on application requirements.
The material is flame-retardant in accordance with UL94V0.
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