Product category:
Heatsinks and Thermal Management
News Release from: The Bergquist Company | Subject: Gap Pad S-Class
Edited by the Electronicstalk Editorial
Team on 12 November 2004
Softest thermal management in sensitive
situations
Bergquist has launched its Gap Pad S-Class thermally conductive gap-filling products providing exceptional thermal performance while applying little or no stress to pressure sensitive components
Bergquist has launched its Gap Pad S-Class family of thermally conductive gap-filling products Designed to provide exceptional thermal performance while applying little or no stress to pressure sensitive components, Gap Pad S-Class materials can conform to the most demanding contours and stack-up tolerances
This article was originally published on Electronicstalk on 22 Oct 2002 at 8.00am (UK)
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The Gap Pad S-Class family consists of three products - the Gap Pad 2000S40, 2500S20 and 3000S30 - offering thermal conductivity of 2.0, 2.4 and 3.0W/mK respectively.
They are particularly suitable for low-pressure PCB applications that require transfer of heat from components of differing heights, to a single heat sink.
Other typical applications include graphics cards; graphics accelerator chips; game stations; notebook computers; disk drives; communications hardware; and automotive powertrain controls.
The Gap Pad S-Class products are built from elastic materials that provide excellent interfacing and wet-out performance, thus easing assembly and reducing the formation of air gaps at the interface with the component.
The materials use a soft and compliant resin formulation that allows them to be used with particularly fragile components and unlike competing products Gap Pad S-Class will not crumble, flake or tear.
Gap Pad S-Class is the softest gap filling material available and it has the same compliant material throughout the entire thickness.
Materials have a naturally tacky cap-filling rubber - with a lower modulus - on their bottom side.
Both sides of the material therefore exhibit inherent tack: this eliminates the need to use adhesives, which typically worsen thermal performance by increasing interfacial thermal resistance.
Natural tack also provides more stable release characteristics, making the materials cleaner and easier to handle in the assembly process.
Gap Pad S-Class materials are offered in standard thicknesses of 0.254 to 3.175mm (0.01 to 0.125in) and are available in sheet form or as die-cut parts of many shapes or sizes.
Standard sheet size is 203 by 406mm (8 by 16in).
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