Metal core PCBs keep powerful LEDs cool
A
The Bergquist Company product story
Edited by the Electronicstalk editorial team
Mar 8, 2007
Dielectric material answers extreme thermal challenges of applications using high brightness LEDs.
Bond-Ply TCP-1000, a new dielectric material from The Bergquist Company, satisfies the extreme thermal challenges of applications using high brightness LEDs.
Without proper thermal management, high brightness LEDs quickly warm-up, reducing their light output.
Lifetime is also related directly to the junction temperature, and so the selection of a good thermally conductive substrate helps considerably in reducing the risks of over-heating the high brightness LED.
Using Bond-Ply TCP-1000 as a circuit board laminate delivers more effective heat transfer from temperature-sensitive components than standard prepreg materials.
It competes effectively with constructions made from epoxy glass-on-aluminium and is equally easy to process in PCB manufacturing.
Bond-Ply TCP-1000, which comes in the form of a metal core PCB, offers superior thermal performance over standard FR4 substrates at a highly competitive price.
The aluminium base layer comes in standard thicknesses of 1.0 and 1.6mm, and the circuit foil is available in 35 and 70um.
Other foil thicknesses are available on request.
Laminated panels are available in 18 x 24 and 20 x 24in sizes.
Bergquist also offers circuits that are custom configured to specific design parameters.
Designed specifically to offer an alternative to various FR4 configurations, Bond-Ply TCP-1000, with a thermal conductivity of 1.5W/mK, has a thermal performance that is at least 3.5x better, supporting the high performance levels needed for applications with increased lumens per watt while managing the LED junction temperature effectively.
The product's continuous use temperature range is -40 to +130C, and it has a dielectric breakdown strength of 5000V AC minimum.
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