Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Accelonix (UK) | Subject: Flip chip bonding solutions
Edited by the Electronicstalk Editorial
Team on 25 March 2005
Flip-chip bonding leads the way in
Brighton
Accelonix will be unveiling a number of new products at this year's Nepcon in Brighton.
Accelonix will be unveiling a number of new products at this year's Nepcon in Brighton Following its recent appointment by Datacon, visitors to Stand G132 will be able to find out more about the latest flip chip bonding solutions, the 8800 FC Quantum dual-head flip chip bonder, launched last year and capable of bonding 3 units per second
This article was originally published on Electronicstalk on 1 Mar 2002 at 8.00am (UK)
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The 8800 FC Quantum delivers high throughput and accuracy and has been developed for high volume manufacture.
It is ideal for all major flip chip assembly processes, from classic solder bump technology to modern adhesive techniques.
Other products include the 2200 apm multi-chip die bonder also from Datacon.
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The 2200 apm combines great flexibility with minimum space requirements (less than 1m2).
Despite its compactness, the 2200 apm die bonder can execute flip chip and die attach tasks in just one module.
Regardless of the target connection technology (flip chip, die attach, or a combination of both), conversions between different applications takes minimal time.
The 2200 apm exhibits perfect handling of very small dice (from 0.17mm) as well as very large dice (up to 25mm, optionally up to 35mm).
The 2200 apm achieves a placement accuracy of 10um at three sigma by virtue of its high precision linear drives for x, y and z axes and a separate servomotor for the theta axis in combination with automatic temperature-drift compensation.
Also being launched in the UK at Nepcon is the Data I/O Imagewriter.
This unique product is used in production for in-system programming of Flash-based microcontrollers and serial memories.
The ImageWriter is a compact module which easily fits into any PCB fixture and provides high throughput ISP for a wide range of device families.
Engineering overhead is reduced to almost zero by virtue of Data I/O's extensive library of programming algorithms.
The product's versatility in operating with or without a supervising PC and in gang mode makes it particularly suitable for ATE integration and working on panellised boards.
Along with the ImageWriter, Accelonix will be showing the Data I/O FlaskPak.
Dedicated to high speed Flash device programming, the FlaskPak is designed with ease of use in production as a primary feature.
Able to program all kinds of Flash and Flash-based microcontrollers, the FlaskPak is particularly suitable for NAND-Flash devices, for which over 20 Flash memory management schemes are available including M-Systems DiskOnChip.
Also new at this year's show will be the versatile Series 4000 from the leading bond test company, Dage.
The 4000 is a multi-function bond tester and can be configured for a host of bond test tasks including wire pull, die shear, ball shear and tweezer pull as well as cold bump pull and vectored pull applications.
In addition Accelonix will also be promoting its boundary scan solutions from Goepel including the latest Scanflex, the next generation JTAG boundary scan hardware launched in February this year.
The Scanflex hardware platform represents a breakthrough in flexibility, modularity and performance.
It reinforces Goepel's extended boundary scan strategy, giving further access for deeper structural testing, programming and emulation.
The modular hardware platform incorporates up to eight independent parallel TAP controllers combined with dedicated resources for event control together with extensible digital and analogue I/O test resources.
Scanflex is compatible with all established boundary scan/JTAG standards such as IEEE1532, IEEE1149.4, IEEE1149.6 etc.
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