Product category:
IC and Hybrid Processing Equipment
News Release from: Accelonix (UK) | Subject: Laurier M9
Edited by the Electronicstalk Editorial
Team on 01 December 2005
Die bonder delivers submicron resolution
Designed to meet the needs of high accuracy bonding applications and specifically those of the optoelectronics and semiconductor industries, the Laurier M9 delivers submicron resolution.
Accelonix has added Laurier's ultra-high-precision flip-chip die bonder to its portfolio Designed to meet the needs of high accuracy bonding applications and specifically those of the optoelectronics and semiconductor industries, the M9 delivers submicron resolution (0.5 micron placement accuracy)
This article was originally published on Electronicstalk on 1 Mar 2002 at 8.00am (UK)
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Accelonix believes that the M9 is the lowest cost, small footprint die bonder in its class.
Paul Phillips, Accelonix's managing director believes that the M9 will prove to be a popular choice for universities and other research establishments: "The M9 is a highly cost-effective and versatile solution for the most demanding die bonding and flip-chip operations".
"It is incredibly flexible and is available with a manual option which keeps the cost low".
"It is also very easy to use so that with as little as a day's training a student or technician can operate the basic system, which is controlled in a Windows XP environment".
"Its small footprint is also a key feature because it takes up very little space in the clean room where real estate is at a premium".
Unlike traditional die bonding systems the M9 uses a split optics system to align die and substrate prior to bonding.
With three of the four axes locked after alignment, uncertainty is improved by an order of magnitude for incredible positioning accuracy.
Additionally, the pitch and roll planarity control system ensures the utmost planarity accuracy for uniform adhesive squeeze even on the largest dice.
The M9 is capable of performing a variety of interconnect methods including traditional die mounting using eutectic or epoxy adhesive and flip-chip using conductive or nonconductive epoxies, reflow and cold bonding.
The bonder can apply handling forces up to 200kg and temperatures up to 500C with options for rapid heating (up to 100K/s) ultrasonics, UV curing, reflow in a gas environment and noncontact planarity levelling.
Applications where the M9 excels include the assembly of optical components (VCSELs, lasers, detectors etc), MEMs, focal plane arrays and LCD displays as well as the more traditional flip-chip, chip-on-board and multichip module applications.
These kinds of device can be found in all sorts of key business and research areas including biomedical, communications, displays, automotive and RF to name but a few.
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