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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Best | Subject: StencilQuik
Edited by the Electronicstalk Editorial Team on 27 May 2004

Stencilling technique simplifies BGA
rework

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Best has developed a newly patented process for the faster and more reliable reworking of BGAs, CSPs and other area array devices.

Best has developed a newly patented process for the faster and more reliable reworking of BGAs, CSPs and other area array devices Using the StencilQuik process most standard pitch BGAs can be placed into the PCB by hand in 10min or less

StencilQuik eliminates the multiple retries often associated with stencil printing using miniature metal stencils.

The StencilQuik method eliminates the poor print problems associated with the release of the metal stencil from the PCB.

In addition StencilQuik eliminates the need to rework damaged solder mask as the stencil becomes a permanent fixture on the PCB.

Independent lab SIR measurements has shown that SteniclQuik reworked BGAs have a 10-fold increase in the insulation resistance values underneath the BGA package.

Initially there will be 300 BGA and CSP patterns available.

"We have found a way to simplify the area array rework process.

The beauty of this new rework process is that it very quite simple".

"Instead of the stencil having to be removed from the board to get a good solder paste print with sufficient volume StencilQuik remains on the board, ensuring not only good print quality but consistent solder paste volume".

"This is a new process using tried and true materials and truly brings value to the end user for applications with large BGA rework volume, the developer who has but a few devices to place but needs the parts placed right now or in cases where mask repair is too time-consuming".

"It is a robust process which improves the reliability of the rework".

"Users who we have shown this stencil technique to are excited this simple yet elegant invention", stated Bob Wettermann of Best.

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