Optical inspection system sets industry standard

The innovative Ersascope optical inspection system is officially the world's industry standard system for visually inspecting BGAs, Micro BGAs, Flip chips etc.

The innovative Ersascope optical inspection system is officially the world's industry standard system for visually inspecting BGAs, Micro BGAs, Flip chips etc, with hundreds of systems already sold to all the main OEM and CEM electronic manufacturers.

The Ersascope system, manufactured by Ersa, not only has an optical lens with the smallest footprint but can see from the ground up so has no limitations unlike other systems that proclaim to get tighter, closer and lower than any other optical system.

A patented lens protection system avoids potentially expensive breakages and downtime.

Sleek and ergonomically designed, the Ersascope optical inspection system offers an on-screen actual magnification range up to 330x.

And, unlike other systems that digitise images giving poor quality, the unit offers a further 800% digital magnification and can easily inspect under components with standoffs as low as 0.051mm (0.002in)and lower.

A specially designed optical tip including fibre-optic lighting and easy adjustable rear lighting means no awkward adjustments to illuminate the solder joints, unlike other systems that require around 20mm to position the unmanageable light sources.

Unique to the Ersascope is the easy adjustable head that allows any position without the need to remove mirrors etc or add further lenses.

With this exclusive Ersa design, operators can look under BGA, CSP, LGA etc packages in spite of low standoff heights as well as inspect other SMT devices.

The patented optics allow for trouble-free safe inspection without damage to PCBs Central to the Ersascope optical inspection system's capabilities is Ersa's ability to achieve any position required within seconds, and the ability to see top and bottom of BGA solder joints without having to continually adjust various controls.

With a slight turn of the lens focus ring, the operator can move through the underside of the component to check for bridging, cold solder joints, open circuits, excess flux, contamination and other process-related failures that X-ray inspection systems cannot easily detect without highly educated and technical interpretation.

The Ersascope optical inspection system floods the underside of the component with bright halogen illumination that does not blind the operator unlike metal halide lights.

The high-quality camera system produces sharp, clear, crisp images on the system's high-resolution flat screen colour monitor.

Coupled with this the Ersascope system offers flexibility for use with any size circuit board or shape.

The widely acclaimed optional Imagedoc software package includes measurement at various levels, process analysis, image enhancement and a visual defect diagnostic program with images supplied by over 1000 companies worldwide and is probably the most extensive database on BGA, SMT and through-hole devices in the world.

This also includes a problem solution database that allows the operator to use the best minds in the world to help solve soldering problems.

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