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Product category: PCB Assembly Equipment and Tools
News Release from: Blundell Production Equipment | Subject: IPulse M4
Edited by the Electronicstalk Editorial Team on 23 June 2006

Placement pick futureproofs surface
mount line

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In 2005 MJP Electronics reached a turning point in its business development, and needed to make some important decisions on updating its surface mount placement capability.

In 2005 MJP Electronics reached a turning point in its business development, and needed to make some important decisions on updating its surface mount placement capability Traditionally, the company had been using a number of smaller, older technology placement machines that had served it well over the years but were unable to deal with the increasing demands of the customer base for both volume and rapidly advancing component technology

Customer demands meant that MJP suddenly needed to assemble complex and densely populated boards with fine pitch devices and odd-form SMT packages.

The choice of machine had to be futureproof, and have the facility to keep ahead of or at least in line with customers' component trends.

MJP's final choice of machine was an iPulse M4 from Blundell Production Equipment, which could easily handle 0.3mm lead pitches, CSPs, micro-BGAs and even has 01005 chip placement capability, plus the benefit of all functions being upgradeable when future demands require.

MJP Managing Director Murray Pulman says: "Specifying the iPulse M4 gave us a single machine that not only replaced all of our previous equipment, but gave us big benefits in capacity as well as technology".

"It ideally suited our predominantly low volume high technology work, and also gives us capacity for increases in volumes in the future, and all within our budget constraint as a small self financed manufacturer".

Shortly after installing its first iPulse M4, MJP experienced a significant increase in volumes, and as a result the company has now added a second machine - another iPulse M4, this time with a multi-tray feeder providing 40 Jedec trays for large components such has BGAs and QFPs.

Blundell Production Equipment also supplied the reflow oven at MJP, which is an Ersa Hotflow 212 - the latest lead free oven design from Ersa of Germany.

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