Product category:
Electronics Manufacturing Quality Assurance
News Release from: Blundell Production Equipment | Subject: Ersascope
Edited by the Electronicstalk Editorial
Team on 31 May 2007
BGA inspection system takes a closer
look
A three-stage upgrade enhances the performance and usability of the award winning Ersascope BGA inspection system.
Blundell Production Equipment has devised a three-stage upgrade for users of its award winning Ersascope BGA inspection system The Ersascope uses miniature camera technology and special lighting to view underneath BGAs to inspect the quality of the solder balls and to make sure that the BGA has dropped correctly to make an intermetallic joint
This article was originally published on Electronicstalk on 23 Jul 2002 at 8.00am (UK)
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Optical inspection system sets industry standard
The innovative Ersascope optical inspection system is officially the world's industry standard system for visually inspecting BGAs, Micro BGAs, Flip chips etc.
The first part of the upgrade is a new 2Mpixel digital video camera, which gives enhanced image quality, and a software upgrade that eliminates the need for a frame grabber card.
A new metal halide light source provides a brighter, whiter light than the former halogen system.
And a new replacement optics kit comprises a lens holder with independent front and back light adjustment, three new lenses for standard BGAs, micro-BGAs and flip chips, plus a look-down lens for general inspection.
The package is completed with two fibre optic brush lights, an extension arm and a new mechanical iris to fit the gooseneck light.
The Ersascope was the original under BGA inspection device and these enhancements ensure that it remains in the forefront of BGA inspection technology.
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