Product category:
Design and Development Software
News Release from: Cadence Design Systems
Edited by the Electronicstalk Editorial
Team on 28 February 2002
ChipPAC standardises on Cadence packages
ChipPAC has standardised on Cadence Advanced Package Designer and Advanced Package Engineer to further automate its IC packaging design process and reduce cycle times.
ChipPAC, one of the world's largest and most diversified semiconductor packaging, test and distribution providers, has standardised on the Cadence integrated circuit (IC) packaging design suites, Advanced Package Designer and Advanced Package Engineer, to further automate its IC packaging design process and reduce cycle times The design solutions are used to support all of ChipPAC's advanced IC packages including BGA, CSP and flip chip
This article was originally published on Electronicstalk on 20 Nov 2001 at 8.00am (UK)
Related stories
Design flow speeds multi-million-gate design
Advanced Hardware Architectures has designed and taped-out a 10-million-gate forward error correction IC using the 64bit Cadence SP and R design flow.
STMicroelectronics uses Cadence VCC methodology
STMicroelectronics has selected the Cadence Virtual Component Co-Design (VCC) for both its automotive and digital consumer platform system-level design methodology and design flow.
"With operating frequencies common in the gigaherts range and ball pitches moving to 0.5mm and less, it is critical that we have a flexible and robust design environment", said Bret Sahn, vice president of Worldwide Design and Characterisation for ChipPAC.
"The continuous improvement of the design process starts with the streamlined and consistent setup and execution of projects across worldwide design centers.
With the use of the Cadence products, coupled with ChipPAC's proprietary SmartDesign process automation tools, we are accomplishing our goals.
Further reading
Parasitic extraction technology joins design flow
Cadence Design Systems and Simplex Solutions have signed a technology-licensing agreement that gives Cadence exclusive distribution rights to Simplex Fire and Ice QX.
Big changes to PCB design environment
The latest release of Cadence's PCB design environment features advances planned to increase productivity and optimise the quality and performance of electronic products.
Many of our customers have also standardised on Cadence Advanced Package Designer, allowing for fast and easy collaboration across the design chain".
A key piece in the deployment of the Cadence technology at ChipPAC has been the use of Skill, a process automation programming language that allows for continuously improving, standardising and speeding the design process.
Cadence packaging tools enable the use of Skill through flexible software architecture.
ChipPAC uses Skill to export formatted Cadence database files that can then be imported into other custom programs for the proactive electrical, mechanical, and thermal analysis of the package design.
"With the increase in high-speed products and the resultant design challenges it is critical that an IC packaging process have an integrated design and analysis environment", said Jamie Metcalfe, vice president of Strategic Marketing for the Cadence PCB Systems Division.
"The Cadence SpecctraQuest signal design and analysis solution allows for dynamic signal integrity evaluation and design layout optimisation.
These issues are of major importance in ChipPAC's SmartDesign process".
SmartDesign is a proprietary, fully integrated IC packaging design and characterisation process that includes electrical, mechanical, and thermal simulation analysis.
It is designed to maximise product reliability and performance while minimising design cycle times.
Cadence Advanced Package Designer and Advanced Package Engineer solutions provide an advanced environment for the design and analysis of IC packaging.
They are part of the overall Cadence PCB solution that allows engineers to consider the design and analysis of the silicon, the package, and the board.
Included are the Specctra autorouter and, in Advanced Package Engineer, SpecctraQuest for IC Packaging.
• Cadence Design Systems: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
