Product category:
Design and Development Software
News Release from: Cadence Design Systems | Subject: Encounter
Edited by the Electronicstalk Editorial
Team on 21 May 2004
Platform simplifies Linedancer geometry
shrink
Fabless semiconductor company Aspex Semiconductor has successfully taped out its Linedancer processor using 130nm technology at 300MHz using the Cadence Encounter digital IC design platform.
Fabless semiconductor company Aspex Semiconductor has successfully taped out its Linedancer processor using 130nm technology at 300MHz using the Cadence Encounter digital IC design platform Responding to the demand of customers serving such markets as communications, web services and imaging markets, Aspex redesigned the device at 130nm, incorporated new features and reduced the die size and power consumption
This article was originally published on Electronicstalk on 15 Apr 2004 at 8.00am (UK)
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Cadence Design Systems has made significant enhancements to its CeltIC 4.1 signal integrity solution, a key technology of the Encounter digital IC design platform for nanometre-scale IC designs.
The Encounter platform enabled Aspex to reach its market window and meet all design and performance goals.
Signal integrity was a key design challenge for Aspex at 130nm.
Using the Encounter platform's CeltIC signal integrity technology, elimination of cross talk and reduction of design iterations were realised within three weeks.
Timing closure was successfully achieved at 300MHz with First Encounter silicon virtual prototyping.
The best-of-breed technology behind the Encounter platform demonstrates again that the platform provides an integrated and fast route to higher-quality silicon through wire-centric design.
"We were thrilled with the whole Encounter design flow from Cadence", said Dr Ian Jalowiecki, vice president of engineering at Aspex Semiconductor.
"Resolving signal integrity and timing closure issues at 130nm painlessly, we were able to meet our design goals within a very aggressive market window".
"Last August we announced that Aspex selected the Encounter platform in order to obtain solutions and support for their next stage of growth", said Guillaume d'Eyssautier, Senior Vice President and General Manager EMEA at Cadence Design Systems.
"We are very pleased today that the Encounter platform has enabled Aspex to move rapidly to smaller geometries and tape out successfully in 130nm".
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