Product category:
Design and Development Software
News Release from: Cadence Design Systems | Subject: Cadence SiP solution
Edited by the Electronicstalk Editorial
Team on 29 June 2006
Software specialises in
system-in-package design
Cadence Design Systems has developed the industry's first complete set of EDA products and capabilities that enable the mainstreaming of system-in-package (SiP) IC design.
Cadence Design Systems has developed the industry's first complete set of EDA products and capabilities that enable the mainstreaming of system-in-package (SiP) IC design The Cadence solution addresses the limitations inherent in the current "expert engineering" approach to SiP design by providing an automated, integrated, reliable, and repeatable process to meet the escalating demand for wireless and consumer products
This article was originally published on Electronicstalk on 20 Nov 2001 at 8.00am (UK)
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With the Cadence SiP solution, companies have the opportunity to expand this market as a broader range of designers gain the ability to bring together many IC and package assembly technologies to create highly integrated products with optimised cost, size and performance.
"We selected Cadence for RF SiP modules because they had the technology, capability and commitment to work with us to define a solution that can be broadly adopted across Freescale enabling us to bring our RF SiP methodology to the next level", said Nigel Foley, Analogue/RF Methodology Manager, Freescale Semiconductor.
The RF SiP Kit includes new Cadence SiP RF products and methodologies for automating and accelerating the entire design process of RF SiPs for wireless communications applications.
It also provides customer-proven SiP implementation methodologies based on an 802.11 b/g wireless local-area-network (WLAN) design.
This enables fast and streamlined adoption of the SiP design technique with low risk.
This Cadence Kit, along with the previously released Cadence RF Design Methodology Kit, expands Cadence's RF design offerings in the wireless segment.
"As a leading provider of foundry solutions for RF ICs, Jazz Semiconductor recognises the need to address the industry trend towards the use of SiPs in reducing system cost", said Marco Racanelli, Vice President of Technology and Engineering, Jazz Semiconductor.
"By integrating our process design kits (PDKs) with the Cadence RF SiP Methodology Kit, Jazz supports Cadence in streamlining the RF SiP design cycle for our joint customers to provide better performance, optimised technology and faster time to market".
Cadence SiP solutions seamlessly integrate into Cadence Encounter for die abstract codesign, Cadence Virtuoso for RF module design, and Cadence Allegro for package/board codesign for end products that are optimised for size, cost, and performance.
"The new Cadence RF SiP Methodology Kit addresses key SiP design challenges such as the lack of integrated tools and methodologies for integrated system, IC, package, and board design and the inability to simulate, verify and analyse complete SiP designs", said Charlie Giorgetti, Corporate Vice President of Product Marketing at Cadence.
"With this kit, customers will be able to realise the benefits of SiP quicker and with reduced risk in sharp contrast with previous solutions".
The goal of the Cadence Kits approach is to enable our customers to accelerate the segment-specific product development.
Cadence Kits address design challenges in market segments such as wireless, wired networking or consumer applications by combining verified methodologies and flows, with IP and demonstrated on a segment representative design and packaged with consulting.
By using Cadence Kits, customers can focus their precious design resources on design differentiation rather than design infrastructure.
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