Product category:
Design and Development Software
News Release from: Cadence Design Systems
Edited by the Electronicstalk Editorial
Team on 14 September 2006
Amkor adopts system-in-package design
Amkor Technology has standardised on Cadence system-in-package design products and methodologies in its worldwide design centres.
Amkor Technology has standardised on the new Cadence system-in-package (SiP) design products and methodologies for use in its worldwide design centres Applications driving the increased use of SiP technology include wireless, networking and consumer-electronics devices such as cellphones, Bluetooth modules, and WLAN modules
This article was originally published on Electronicstalk on 20 Nov 2001 at 8.00am (UK)
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Faced with escalating customer demand for these applications and increasing SiP complexity, Amkor and Cadence collaborated on a complete, integrated solution for the implementation of digital and RF SiPs.
"Cadence SiP technology allows us to extend and enhance the value of the design and manufacturing services we deliver to our customers", said Steven Lowder, Amkor's Vice President, Design Services.
"Combining Cadence's technology with Amkor's SiP design flow will integrate silicon and package design at new levels, which will further optimise the size, performance and cost of our customer's products".
According to Keith Felton, Group Director, Product Marketing IC Packaging and SiP solutions, Cadence Design Systems, consumer demand for compact, functionally dense wireless and multi-media products is fuelling the growth in SiP implementation.
The new Cadence products support designers of the leading-edge devices by moving what was, until recently, an expert engineering-design process into the mainstream.
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