Product category:
Design and Development Software
News Release from: Cadence Design Systems | Subject: Virtuoso
Edited by the Electronicstalk Editorial
Team on 14 December 2006
Custom design platform adds 90nm RF
process
Virtuoso custom design platform features TSMC 90nm RF process design kit
Cadence Design Systems and TSMC have jointly announced the availability of TSMC's 90nm RF Process Design Kit (PDK) for the new Cadence Virtuoso custom design platform The 90nm RF PDK is one in a series of TSMC PDKs supporting the latest Virtuoso platform, a comprehensive system that accelerates silicon-accurate design of analog, mixed-signal, and RF devices
This article was originally published on Electronicstalk on 26 May 2003 at 8.00am (UK)
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The Virtuoso custom design platform is claimed to be the world's first comprehensive platform for fast, silicon-accurate custom, analogue, RF and mixed-signal design.
"Our 90nm RF Process Design Kit for the Virtuoso platform will improve performance and productivity, and accelerate time to market for RF designs targeting TSMC's industry-leading technology", said Ed Wan, senior director of Design Services Marketing at TSMC.
"The rapid development of TSMC's 90nm RF PDK for the new Virtuoso platform underscores the importance of Virtuoso technology among innovative mixed-signal and RF designers", said Charlie Giorgetti, corporate vice president of Product Marketing at Cadence.
"We look forward to working with TSMC to develop further PDKs with the new Virtuoso platform, in support of our mutual customers' growing demand".
The Virtuoso platform and TSMC's 90nm RF PDK support designers in high-growth IC markets, such as wireless communications.
These technologies offer advanced processes for unprecedented integration of digital and mixed-signal designs.
TSMC's 90nm RF PDK for the latest Virtuoso platform is available through the company's customer website, TSMC-Online, or by contacting any TSMC account manager.
TSMC claims to be the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven libraries, IP, design tools and reference flows.
The Company's total installed capacity in 2006 will exceed seven million (8in equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, and one six-inch fab.
TSMC also has substantial capacity commitments at its wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 65nm production capabilities.
Its corporate headquarters are in Hsinchu, Taiwan.
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