Processor module applies dual-core Xenon CPU

High performance Advanced Mezzanine Card (AdvancedMC) double width full height processor module is suitable for AdvancedTCA, MicroTCA and proprietary platforms.

Concurrent Technologies has a new high performance Advanced Mezzanine Card (AdvancedMC) double width full height processor module suitable for AdvancedTCA, MicroTCA and proprietary platforms.

The AM 100/20x uses the dual-core Intel Xeon processor to provide high performance processing, and the Intel 3100 chipset, which combines server-class memory and I/O controller functions into a single component.

The AM 100/20x is designed for use in a variety of applications including wireless basestations, Voice over IP, media-servers, blade-servers within the communication market as well as projects within the defence, security, and industrial markets.

Accordingly, the AM 100/20x supports a variety of industry standard operating systems.

Glen Fawcett, CEO of Concurrent Technologies commented: "This new high performance AMC processor board provides a marked improvement in performance/watt compared with a single-core Intel Xeon processor".

"By using processors and chipsets from Intel's embedded roadmap, we can ensure that the product will be available for at least 5 years after release - a very important requirement for the majority of our customer base, whether they are in the defence or telco market sectors".

The AM 100/20x module supports the dual-core Intel Xeon processor LV at 2.0GHz or the dual-core Intel Xeon Processor ULV at 1.66GHz.

By using appropriate operating systems and applications software, a computing performance increase, for the same clock frequency, of up to two times a single-core Intel Xeon processor is achievable.

The thermal design power (TDP) for the dual-core Intel Xeon processor LV at 2.0GHz (667MHz FSB, 2Mbyte shared L2 cache) is 31W versus 35W TDP for the single-core LV Intel Xeon processor at 2.0GHz (400MHz FSB, 512Kbyte L2 cache); the dual-core Intel Xeon processor ULV at 1.66GHz (667MHz FSB, 2Mbyte shared L2 cache) with a TDP of 15W gives a remarkable increase in performance per watt.

To enhance overall memory and I/O performance the AM 100/20x uses the Intel 3100 chipset.

The Intel 3100 chipset, a single chip embedded server chipset, interfaces up to 16Gbyte of DDR2-400 ECC memory with a peak memory bandwidth of 3.2Gbyte/s.

"For military, defence and telco applications, the combination of the dual-core Intel Xeon processor LV and the Intel 3100 chipset is maximising energy efficient performance for thermally dense computing environments like the AMC market segment", says Rose Schooler, Director of Marketing, Intel Infrastructure Processor Division.

"For 30 years Intel has been continuously supporting the embedded market segment, and Concurrent Technologies is utilising the benefits of embedded Intel architecture to bring innovation and long term stability to this leading edge standards-based form factor".

The AM 100/20x is designed in compliance to AMC.0 (including full hot swap and IPMI capabilities), AMC.1 Type 8 (PCI Express x8), AMC.2 Type E2 (two Gigabit Ethernet) and AMC.3 Type S2 (four Serial ATA150 ports).

The module also features a graphics interface, four USB 2.0 ports and two RS232 ports.

For ease of integration, many of today's leading operating systems are supported including Linux, Windows 2000, Windows Server 2003, Windows XP, Windows XP Embedded and QNX.

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