Product category:
Design and Development Software
News Release from: Celestry
Edited by the Electronicstalk Editorial
Team on 23 October 2001
Texas plumps for Celestry for top-end
improvements
Texas Instruments is to use Celestry's Hot-Carrier Injection (HCI) and Negative Bias Temperature Instability (NBTI) analysis products to help increase the performance of its high-end designs.
Texas Instruments is to use Celestry's Hot-Carrier Injection (HCI) and Negative Bias Temperature Instability (NBTI) analysis products to help increase the performance of its high-end designs Celestry's reliability products RelPro, a device-level reliability analyser and model parameter extractor and RelXpert, a circuit-level reliability simulator were selected to address key issues of today's IC processes
This article was originally published on Electronicstalk on 19 Oct 2001 at 8.00am (UK)
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To maximise performance without risking excessive wearout failure rates, a designer must analyse and address HCI and NBTI effects.
Celestry's reliability simulation allows the designer to manage the tradeoffs between circuit performance and aging as a result of channel lengths and gate oxide thickness reductions found in IC processes of 0.18 micron and below.
"We selected Celestry because of their experience in reliability analysis and unique 'hands-on' knowledge of deep submicron silicon issues.
Celestry's products will aide TI in more aggressive design shrinks and in reducing wasted performance and silicon lost by overly pessimistic design guardbands", noted Tom Thorpe, Vice President, Logic Technology Development, Texas Instruments.
Tim Rost, Manager, Component Reliability Group at TI added, "HCI and NBTI continue to be important reliability issues that need to be properly addressed.
The RelXpert tool makes it easy for designers to assess and prevent circuit level issues caused by these effects".
"We are pleased to have our reliability tools selected by TI, a leading developer of high-performance digital signal processing and analogue products", said Dr Zhihong Liu, President and CEO of Celestry.
"Celestry has been deeply involved in reliability analysis and simulation R and D for many years.
Now that the time has come that high performance designs need to quantitatively address the impacts of today's process issues, Celestry's solutions can quickly and accurately address these issues in both full-chip transistor level and gate level designs".
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