Product category:
Heatsinks and Thermal Management
News Release from: Chomerics Europe | Subject: Thermattach T411
Edited by the Electronicstalk Editorial
Team on 22 March 2001
Tape sticks sinks without fasteners
The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners.
The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners when bonding heatsinks to microprocessors and other heat-generating semiconductors Suitable for bonding heat sinks to any plastic component package including those with non-flat surfaces, Thermattach T411 double-sided silicone adhesive tape combines a high bond strength, pressure-sensitive adhesive (PSA) with an expanded aluminium mesh carrier layer
This article was originally published on Electronicstalk on 6 Apr 2001 at 8.00am (UK)
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Its high bond strength allows the tape to be used to attach components to vertical heatsinks or metal chassis walls, while the mesh carrier allows the tape to conform to the curved surfaces of moulded plastic IC packages.
Chomerics Thermattach T411 tape has a thickness of 0.28mm and a thermal impedance rated at 6.5Ccm2/W.
The high-performance silicone PSA ensures adhesion to silicone-contaminated plastics and other low-energy surfaces.
Thermattach T411 has a rated operating temperature range of -50 to +150C.
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