Ceramic heat spreaders replace heatsinks

Edited by the Electronicstalk editorial team Apr 6, 2001

Designed for EMI-sensitive applications, the latest low-profile heat spreaders from Chomerics provide a simple and effective method of cooling semiconductors.

Designed for EMI-sensitive applications, the latest low-profile heat spreaders from Chomerics provide a simple and effective method of cooling semiconductors in designs where restricted space prevents the use of conventional heatsinks or heatsink/fan combinations.

Ideal for cooling microprocessors and other devices in high-component density applications, the new C-Wing heat spreaders are ceramic, electrically nonconductive devices that feature a strong, pressure-sensitive adhesive for simple attachment to component packages.

C-Wing ceramic heat spreaders are available in a variety of standard sizes that can be quickly and easily added to existing designs to lower component temperatures and improve reliability.

Standard C-Wing parts are made from aluminium oxide and offer a thermal conductivity rating of 26W/mK.

Chomerics can also supply aluminium-nitride versions for use in applications where higher levels of cooling performance are required.

Using the Chomerics Thermattach pressure-sensitive adhesive, C-Wing heat spreaders have a profile of just 1.53mm and are flammability rated in accordance with UL 94V-0.

In addition to the standard parts, Chomerics can use advanced thermal measurement and modelling techniques to develop application-specific heat-spreader designs.