Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Chomerics Europe | Subject: Therm-A-Form T646
Edited by the Electronicstalk Editorial
Team on 04 June 2001
Elastomer minimises component stress
Suited to encapsulating electronic devices, the latest form-in-place flexible, thermally conductive silicone elastomer from Chomerics offers high thermal conductivity.
Suited to encapsulating electronic devices, the latest form-in-place flexible, thermally conductive silicone elastomer from Chomerics offers high thermal conductivity while minimising stress on the component being cooled Chomerics Therm-A-Form T646 thermal interface compound efficiently transfers heat from components to heatsinks, PCBs, metal enclosures and chassis
This article was originally published on Electronicstalk on 22 Mar 2001 at 8.00am (UK)
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Tape sticks sinks without fasteners
The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners.
It eliminates the need for a conventional moulded sheet when cooling multi-height components and conforms to irregular shapes without compressive force, ensuring that all gaps are filled.
Therm-A-Form T646 is supplied as a kit containing the silicone binder and aluminium oxide filler liquid as reactive components.
When mixed, typical cure time is 3min at 150C or 1h at 60C.
Thermal conductivity of the compound is rated at 0.9W/mK.
The Therm-A-Form T646 compound can be supplied in 45, 177 and 200cm3 kit sizes for use with manual or pneumatic dispensing systems, and a 4gal kit is also available for high-volume applications using automatic dispensing equipment.
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