Product category:
Heatsinks and Thermal Management
News Release from: Chomerics Europe | Subject: Thermflow T766
Edited by the Electronicstalk Editorial
Team on 08 July 2002
Thermal interface simplifies heatsink
removal
Thermflow T766 phase-change material provides a low thermal resistance interface between hot components and heatsinks.
Thermflow T766 phase-change material from Chomerics provides a low thermal resistance interface between hot components and heatsinks Typical applications are found in thermal modules in laptop computers and between microprocessors and heatsinks in PCs
This article was originally published on Electronicstalk on 22 Mar 2001 at 8.00am (UK)
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The latest thermally conductive adhesive tape from Chomerics can significantly simplify PCB assembly by eliminating thermal grease and mechanical fasteners.
The material, which has a thermal impedance of 0.04Cin2/W, consists of a tacky, electrically nonconductive phase-change film coated onto one side of a highly conformable metal foil.
This construction enables easy removal of heatsinks for rework with no residue being left on component surfaces.
The film layer adheres to the heatsink or spreader, with the foil layer providing protection before and during assembly.
Once assembled between the heatsink and component, the phase-change film softens at component operating temperatures to fill any air gaps and enhance the thermal performance of the complete assembly.
Thermflow T766 pads have an overall thickness of 0.089mm and an operating temperature range of -60 to +125C.
Parts are supplied kiss-cut on rolls for ease of installation, and can be manufactured with either standard or custom profiles.
(This was Electronicstalk's Top Story on 5 July 2002).
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