Thermal tape sticks sinks to plastic BGAs

Thermattach T410 thermal tape from Chomerics has been developed to provide a reliable method for bonding heatsinks to hot-running devices.

Thermattach T410 thermal tape from Chomerics has been developed to provide a reliable method for bonding heatsinks to hot-running devices.

The highly thermally conductive material is especially suited to applications that require heatsinks to be bonded to plastic ball grid array (BGA) devices.

T410 thermal tape has an overall thickness of 0.18mm, and features a 0.05mm aluminium foil carrier that is coated on one side with a silicone based pressure sensitive adhesive (PSA).

This provides strong adhesion to low-energy surfaces such as plastic packages that may also be silicone contaminated.

The adhesive used by Chomerics for this type of application is more reliable, and gives a stronger bond than commonly used acrylic adhesives.

The other side of the tape is coated with a thermally loaded, high strength acrylic PSA designed to bond securely to the heatsink.

Optimisation of adhesives used to match application requirements has resulted in a material that combines strength, reliability and thermal performance.

Both sides of the material are protected by liners that can be easily peeled away prior to assembly.

Thermattach T410 has an operating temperature range of -50 to +150C and is available in roll form or kiss-cut standard and custom shapes.

(This was Electronicstalk's Top Story on 19 September 2002).

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