Conductive adhesive comes in handy syringe

The two-part Cho-Bond 584-29 conductive adhesive now comes in a convenient syringe system that allows easier mixing and more precise application.

The two-part Cho-Bond 584-29 conductive adhesive now comes in a convenient syringe system that allows easier mixing and more precise application.

The material, which comprises an epoxy binder and a filler containing pure silver, can be used in place of soldering and welding in a wide range of electronic equipment assemblies.

Typical applications include PCB repair, bonding of mesh gaskets and chip bonding.

Compared with the current supply format of two-part, flexible divider pouches, the syringe system simplifies the mixing of the resin and hardener, improves dispensing accuracy, and reduces the amount of compound that is wasted.

The low viscosity of Cho-Bond 584-29 means it can be applied to intricate assemblies through fine gauge needles to achieve very thin bond lines.

The adhesive provides a reliable bond having a minimum lap shear strength of 8.28MPa.

Cho-Bond 584-29 has a low volume resistivity of just 0.002ohm/cm when used as a highly conductive pathway.

The material has an elevated temperature (113C) cure time of just 15min and a room temperature cure time of 24h.

It can be used in applications that have an operating temperature range between -55 and +125C.

The adhesive, which contains no volatile organic compounds (VOCs), is supplied in a 3g dispense system that consists of two syringes - one containing the hardener, one containing the resin - separated by a connector.

This allows rapid mixing of the two parts that are then dispensed via one of the syringes.

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