Thermally conductive gap fillers prove their worth

High volume applications adopt precured thermally conductive gap fillers as the preferred solution.

Chomerics T630 and T630G dispensable form-in-place gap filling materials are finding a growing number of applications in high volume automotive and consumer equipment.

With the ability to be applied quickly with excellent repeatability using automated dispensing equipment, the economical materials provide a valuable option for engineers looking to solve thermal problems in high volume applications.

Therm-A-Gap T630 and T630G are fully cured silicone based materials that enable effective heat transfer between electronic components and the chassis or enclosure wall of a piece of equipment.

They can be dispensed directly onto the target surface and do not require a post-application curing cycle.

This means that mating components can be assembled immediately after the application of the material; a characteristic that is valuable in high volume, automated production environments.

Compared with alternative approaches such as die-cut sheet gap fillers, dispensed materials such as T630 and T630G offer potential cost savings plus faster and easier automated assembly.

Being able to achieve 50% deflection with just 7kPa of applied pressure allows the material to be used with delicate components and in applications where high assembly pressures are difficult or expensive to achieve.

The materials are able to fill gaps ranging from 0.5 to 3mm.

An additional benefit of T630 and T630G is the vibration dampening effect they can provide; this is especially useful in automotive modules.

Both T630 and T630G are UL94V0 compliant and have an operating temperature range of -50 to +150C.

Shelf life is 18 months.

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