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Product category: Electronics Manufacturing Materials and Consumables
News Release from: CoorsTek | Subject: Design guide for thick-film ceramic substrates
Edited by the Electronicstalk Editorial Team on 21 March 2008

Ceramic substrate applications explained

Guide offers electronics engineers the latest design guidelines for standard thick-film and laser machined ceramic substrates.

CoorsTek has published a new version of its widely used design guide for thick-film ceramic substrates The first significant update in several years, this guide offers electronics engineers the latest design guidelines for standard thick-film and laser machined ceramic substrates

Two separate design specifications, one for laser machining and the other for thick-film ceramic substrates, have been combined into one completely updated and comprehensive guide.

New features include smaller hole and slot sizes (down to 0.0762mm), additional substrate thickness offerings (up to 3.556mm), laser pulse depth and spacing tolerances, special edge treatments (SilkEdge finish and SmoothEdge finish), additional materials (DuraStrate substrates, MidFilm substrates, economy grade substrates), comprehensive material properties charts, easier-to-understand camber design specifications.

"We took a number of extra steps to ensure this guide would be thoroughly useful to the electronic engineer", states Andrew Golike, Technical Product Manager for CoorsTek.

"It's designed to ease the specification process for our customers - especially for new and developing electronics markets", he adds.

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