Product category:
Design Services
News Release from: Conekt
Edited by the Electronicstalk Editorial
Team on 22 August 2006
X-ray system to support analytical
examinations
Conekt has invested Eur 180,000 to enhance current quality, reliability and failure analysis capabilities within its Engineering Services Division in Shirley, UK.
Conekt, the engineering consultancy arm of TRW Automotive, has invested Eur 180,000 to enhance current quality, reliability and failure analysis capabilities within its Engineering Services Division in Shirley, UK The investment includes a powerful 160kV X-ray system
This article was originally published on Electronicstalk on 7 May 2004 at 8.00am (UK)
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The microfocus X-ray system is able to produce real time X-rays images in excess of 10,000 times magnification and allows the examination of complex components and assemblies with three axis manipulation and rotation.
The accompanying software provides image enhancement and measuring functions, as well as computer numerical control (CNC) inspection programming for semi-automatic inspection.
"Companies are under increasing pressure to guarantee the reliability and quality of their products and components", explained Chris Tarling, Business Manager for Conekt's Engineering Services Division.
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"Our engineers specialise in testing and analysis and the new X-ray system will enable us to provide customers with instant high resolution images of components and assemblies to support analytical examinations".
"In parallel with our design expertise, this will allow our engineers to help clients eliminate design issues that could reduce reliability and increase warranty costs".
Conekt already boasts a scanning electron microscope (SEM) with elemental analysis (EDS), infra-red equipment (FTIR) for organic analysis and an extensive range of sophisticated optical microscopy equipment with digital imaging.
The new system will enable more detailed nondestructive reliability and failure evaluations.
Applications for the system include electronic equipment analysis of solder joints, ball grid arrays (BGA) and printed circuit board (PCB) assemblies, as well as enabling Conekt to carry out analysis on large castings and metallic components, such as braking or electric drive systems.
BGA inspection also includes semi-automated analysis software for solder ball position, shape and voiding Although it is designed predominantly for use in the electronics industry, the system can also be used to carry out high powered examination to discover possible faults, such as assembly or in-service damage, within nonelectrical components.
Chris continued: "Over the last year, Conekt has made significant investment in test and validation capabilities to stay one step ahead of customer requirements and changes in legislation".
"Conekt's new X-ray system is one of the highest specified available and will reinforce Conekt's position as one of the leading test and validation centres in the UK, USA and China".
The X-ray system is now operational, and this investment is the latest in an extensive development programme for Conekt's Engineering Services Division, following on from recent purchases of high specification microscopy and automatic micro-sectioning equipment, as well as lightning strike and high intensity radiated field (HIRF) test systems.
The system was sourced from Contax, the UK agent for Phoenix X-Ray.
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