Product category:
Electronics Manufacturing Quality Assurance
News Release from: HumiSeal Europe | Subject: Lead-free test kits
Edited by the Electronicstalk Editorial
Team on 22 February 2005
Lead-free test kits aid compliance
New lead-free test kits from Concoat Systems will help manufacturers validate solderability tests on their new generation of lead-free component and substrate finishes to IEC60068-2-69.
New lead-free test kits from Concoat Systems will help manufacturers validate solderability tests on their new generation of lead-free component and substrate finishes to IEC60068-2-69 In addition, customers will receive a product manual and CD-ROM featuring information on solderability testing and the National Physical Laboratory (NPL) "Good practice guide"
This article was originally published on Electronicstalk on 14 Dec 2001 at 8.00am (UK)
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To help electronics manufacturing companies qualify and quantify their new lead-free manufacturing processes, Concoat Systems has developed Lead-Free Test Kits for its bench-top MUST System II Plus Solderability Test System.
The kits include a Lead-Free Bath and Globule Set and Lead-free Accessories Kit and together they provide the hardware, consumables and information required to test lead-free solderability to IEC60068-2-69.
Concoat Systems Business Development Manager, Nick Redgrave-Plumb, explained: "Solderability analysis is a proven method for helping electronics manufacturers maintain process reliability and product quality".
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"With the lead-free transition date of 2006 fast approaching, manufacturers are keen to apply solderability tests to the new generation of lead-free component and substrate surface finishes".
"However, for lead-free solderability tests to be valid there must be no cross contamination from lead-based solders".
In fact, just 0.01% lead contamination is sufficient to invalidate the results.
To counteract this, Concoat has developed the new test kits to provide totally separate test environments for leaded and unleaded boards.
MUST System II Plus, from Concoat Systems, has a wetting balance capable of testing surface mount and through hole devices, plus PCB pads and plated through holes.
During the test the sample is fluxed, dried, suspended from the wetting balance and immersed in a molten solder bath or small globule of molten solder.
As the solder meniscus climbs up the sample the system measures the vertical force over time and calculates the wetting force - the larger the wetting force, the better the solderability.
The Lead-Free Bath and Globule Set comprises four globule units (4, 3.2, 2 and 1mm), a solder bath and a 1kg bar of SAC305 alloy (Sn 96.5%, Ag 3.0%, Cu 0.5%).
The Lead-Free Accessories Kit includes four jars of SAC305 solder pellets (5, 25, 100 and 200mg), Arax solder wire, three jars of flux (SMNA, Actiec 2 and 5), plus accessories including cotton buds, tweezers, dropper bottle, spatula, 100ml beaker, filter papers, gloves and an assembly key.
In addition, the Accessories Kit includes a manual on the MUST System II Plus and Accessories and a CD-ROM featuring information on solderability testing and the National Physical Laboratory (NPL) "Good practice guide".
Redgrave-Plumb continued: "As lead-free manufacturing raises soldering temperature and closes the process window, the ability to accommodate even mild deteriorations in solderability is diminishing".
"As a consequence, solderability issues are moving up the priority list".
"Given that poor solderability is often related to circumstances beyond a manufacturer's direct control, such as device storage conditions and age, they need the ability to build lead free solderability tests into their quality control process".
"The Lead-Free Bath and Globule Set and Lead-Free Accessories Kit provide this capability for existing and future MUST System users".
"During the lead-free transition phase the kits are doubly important, letting users analyse both leaded and lead-free samples without fear of cross contamination".
Concoat Systems Managing Director, Graham Naisbitt, added: "Although the bench-top MUST System II Plus has traditionally been used by high reliability manufacturers, the transition to lead-free production is encouraging all electronics manufacturers to build solderability analysis into their test regime to avoid the massive and avoidable cost of unnecessary rework, repair and worst of all - premature field failure".
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